Decline of DRAM production
DRAM wafer output, which peaked in 2008 at 16.4 million 300-millimeter-equivalent wafers, is expected to decline by 24% to 13 million this year, says IHS…
DRAM wafer output, which peaked in 2008 at 16.4 million 300-millimeter-equivalent wafers, is expected to decline by 24% to 13 million this year, says IHS…
STMicroelectronics has an SOI process which can deliver RF front end modules supporting the 40 different frequency bands required for LTE…
Black magic has a new meaning. It is the sub-optimal way most supercapacitors rely on soot from burnt coconut shells and some homespun trickery.
The soot is deposited on something akin to cooking foil and that often has the 40 micron thickness of lithium-ion battery electrodes ten years…
Twenty kilometres up, slung under balloons from the same company that helped Felix Baumgartner jump from the edge of space last year, a payload of solar panels and wireless antennas is helping Google’s Project Loon bring wireless internet access to the most remote parts of the world. The ultimate…
This year there will be a 37% rise in the market for chips for tablets and a 2% fall in the market for chips for PCs, says IC Insights…
X-Fab has enhanced its XP018 process with multiple options to lower chip costs for high-performance analog applications such as audio, sensor interface…
Rambus and STMicroelectronics have signed a licensing agreement giving ST access to Rambus’ memory and interface technologies, and Rambus access to ST’s FD-SOI process technology…
The China Post reports that local Taiwanese firms Richtek, Elan, TSMC and eGalax_eMPIA (EETI) all expect a good Q3.
Richtek’s deputy general manager Guo-Cheng reckons that the new Wintel combo of Win 8 and the latest Intel PC chips won’t stimulate demand in the PC market but…