Digi-Key signs 3D silicon device supplier
Digi-Key has signed a distribution agreement with IPDiA, a French spin-out from NXP designing 3D silicon sub-mounts, 3D silicon RF, and 3D silicon capacitor products.
“High reliability and stability capacitors are in great demand for medical, aeronautics, avionics, automotive, and military applications. IPDiA’s innovative design is ideally placed to serve this area of growth,” said Tom Busher, vice president, global interconnect, passives and electromechanical product at Digi-Key.
The firm has developed a means of integrating tens or even hundreds of passive components, with performance better than that of traditional MLCCs.
Applications for these innovative devices are myriad, including medical, aerospace, and automotive markets.
Digi-Key has also recently signed the Adesto Technologies line of non-volatile memory devices.
This product portfolio includes serial flash and conductive bridge RAM (CBRAM) memory technology.
CBRAM is notable for being CMOS compatible and Adesto’s CBRAM product will be available later in 2013.