Auto process launched by GloFo

Globalfoundries has made available a 55nm process qualified for automotive ICs to AEC-Q100 Group D.

AEC - automotive electronics council

AEC – automotive electronics council

It comes with technology and design enablement capabilities  to improve the efficiency, performance, and power consumption of automotive ICs while keeping to  safety and quality standards.

It allows customers to  migrate their automotive microcontrollers, ASSPs and ASICs to a more advanced process,  leveraging  area, performance and power benefits of the process.

The platform supports the implementation of non-volatile memory (NVM) in MCUs and SoC designs, as well as SST-based embedded flash technology of automotive grade with an endurance of 100K erase/program cycles or higher and data retention of more than 20 years.

GloFo is a member of  Automotive Electronics Council (AEC).

“Vehicle manufacturers and their suppliers are facing extremely challenging requirements by both regulators and customers. Better fuel efficiency, higher safety standards, increased in-vehicle communications capabilities and more demanding consumer requirements are all driving the need for more performance and lower power ICs for these systems,” says GloFo’s Paul Colestock.

The platform’s complete design enablement support through certified models and design rules, PDKs and EDA tools support streamline the automotive IC design process. Its automotive-specific flow includes defect detection, defect reduction and outlier controls to provide significant improvement in quality and reliability. DFM support for automotive builds in quality and yield at the design stage.

The automotive platform supports the use of ARM core technology with a variety of standard cell and compilers, as well as IP blocks for GPIO, interface, and oscillator functions.

The platform is backed by an automotive services package to meet automotive grade quality and reliability requirements. The services offering includes 15 years record retention, a continuous improvement program with the aim to achieve zero defects, and comprehensive failure analysis and 8D problem resolution.

The 55nm low power process PDK, embedded flash PDK, and flash macro design service are available now.

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