Schadenfreude reared its head in Southern California this week with Broadcom CEO commenting on the industry’s problems with 28nm. Meanwhile it is reported that TSMC is investing heavily in 20nm to secure Apple’s business.
Asked about competitors’ ‘more highly integrated’ (i.e. 28nm) products, Scott McGregor replied that it was “A little hard to determine whether it’s a allocation issue, or whether it’s a product issue or other things. We hear various rumors along those lines.”
He added that “Customers are hesitant to bet on Qualcomm – that has not worked well as a strategy for those who put all their eggs in one basket.”
Broadcom’s strategy on 28nm was to wait on the HPM process which, said McGregor, “Tends to have a better figure of merit than the HP or the Poly/SiON processes that some of our competitors are using. So when we do come out with 28-nanometer products, they should have better specs, better power performance and whatnot.”
So, McGregor pointed out, Broadcom has not suffered initial ramp issues of its competitors and its business has not been limited by access to wafers.
Meanwhile DigiTimes reports that TSMC will invest another $700m this year to bring 20nm on more quickly to secure Apple’s business in 2014.
Apple, reportedly, has stuck with 40nm and 65nm technology rather than risk its products on the availability of 28nm parts.