The project is led by Infineon. “The partners in the eRamp project have the entire power electronics value creation chain in mind, from generation and transmission all the way to consumption of electric energy. Together we will create new knowledge and new products,” says Dr. Reinhard Ploss, CEO of Infineon.
eRamp research activities will focus on the rapid introduction of new production technologies and further exploration of chip packaging technologies for power semiconductors. The German project partners will investigate and develop new methods for speeding up the start of the production run.
In order to investigate research results for practical viability exactly where the new production technologies will be implemented, the German research partners will use existing pilot lines and comprehensive production expertise at various German sites, including Dresden (Infineon: power semiconductors based on 300mm wafers), Reutlingen (Bosch: power semiconductors, smart power and sensors based on 200mm wafers) and Regensburg (Infineon: chip packaging technologies for power semiconductors).
Infineon, Osram and Siemens will work together closely to research and construct testing equipment and demonstrators for the evaluation of newly developed chip embedding technologies.
In Germany, the Technical University of Dresden and West Saxon University of Applied Sciences Zwickau are also participating in research. In addition to Bosch, Infineon, Osram and Siemens.
German business is represented by the companies SYSTEMA Dresden, an IT specialist vendor for automation in the manufacturing industry, HSEB Dresden, provider of optical inspection, review and installation, and SGS INSTITUT FRESENIUS, a leading vendor of chemical and physical laboratory analysis.
The research partners in the eRamp project are (in alphabetical order): AMS AG (Unterpremstatten, Austria), CISC Semiconductor GmbH (Klagenfurt, Austria), HSEB Dresden GmbH (Dresden, Germany), Infineon Technologies (Germany: Dresden, Regensburg, Munich; Villach, Austria and Bucharest, Romania), JOANNEUM RESEARCH Forschungsgesellschaft GmbH (Graz, Austria), Lantiq (Villach, Austria), Materials Center Leoben Forschung GmbH (Leoben, Austria), NXP Semiconductors (Gratkorn, Austria and Eindhoven, Netherlands), Osram GmbH (Munich), Polymer Competence Center Leoben GmbH (Leoben, Austria), Robert Bosch GmbH (Stuttgart, Germany), SGS INSTITUT FRESENIUS (Taunusstein, Germany), Siemens AG (Berlin, Munich), SPTS Technologies Ltd (Newport, UK), Stichting IMEC Nederland (Eindhoven, Netherlands), SYSTEMA Systementwicklung Dipl.-Inf. Manfred Austen GmbH (Dresden), Slovak University of Technology (Bratislava, Slovakia), Technical University Vienna and University of Innsbruck (both in Austria) as well as Technical University Dresden and the West Saxon University of Applied Sciences, Zwickau (Germany).
The Project eRamp is co-funded by grants from ENIAC Joint Undertaking and from Austria, Germany, the Netherlands, Romania, Slovakia und the UK.