"The ELG addressed the challenge put forward by VP Kroes to double the value of semiconductor production in Europe," says a statement by Kroes' office, "the roadmap will be published in the beginning of 2014 and the group will then focus on implementation and execution."
"All options are envisaged starting with the expansion and the upgrading of existing capacity, to the potential for new facilities," says the statement, "ambitious pilot lines for new technologies and new forms of production including leading-edge equipment and material technology will be supported, beginning in 2014. These will build on the 1.8 billion euros investment and experience in ENIAC pilot lines launched in 2012-2013. Future capacity will be matched to demand growth."
"The plan includes initiatives on chip design and architectures aiming at strengthening the design and fabless industries and the whole electronic component ecosystem in Europe. It will commence in 2014 with specific R&D&I initiatives to provide easy and affordable access to manufacturing facilities for design SMEs and to support the development of multidisciplinary skills."
The statement continues: "Europe will continue to invest to prepare for the next generation of production materials and equipment for diversified needs including mixed production in 300mm and the transition to 450mm."