Infineon and GloFo to have 40nm eFlash process in 2015
Infineon and GloFo are working on a 40nm embedded flash process for automotive and secure MCU applications for qualification in 2015.
The process will initially be installed at GloFo’s Singapore site and will be transferred to Infineon’s Dresden site.
“We trust in Globalfoundries with their excellent manufacturing background and sites on different continents to fulfill Infineon’s stringent quality, infrastructure security and business continuity requirements,” says Infineon’s Arunjai Mittal.
“Infineon’s decision to choose Globalfoundries as the foundry partner for the 40nm embedded Flash technology node recognizes our unique ability to offer one-foundry-solutions supported by multiple fabs in different geographies,” says Ajit Manocha, CEO Globalfoundries.
This agreement with Globalfoundries is consistent with Infineon’s strategy to engage in technology co-development for CMOS-based technologies in 65nm and below.
Process and product qualification for security microcontrollers is planned for the second half of 2015. Automotive microcontroller production start is scheduled for the first half of 2017.