Intel to ship LTE modem in August
Intel is to start shipping its first LTE modem this month. It will support 15 different spectrum bands.
The chip will be made by TSMC. Intel is still two to three years away from putting its modems onto its own processes.
A Cat 3 LTE, Intel’s chip has a theoretical maximum throughput of 100Mbps.
In Q4 it will have a Cat 4 device capable of 150Mbps and supporting VoLTE – Voice over LTE.
Intel is going all out to catch Qualcomm in mobile. “For us, it is the clear strategy, the clear plan, to go into a leadership position, and we are currently in the transition to do that,” says Hermann Eul, GM of Intel’s mobile group.
In the first half of next year, Intel plans to ship a chip supporting carrier aggregation which uses more than one channel to increase bandwidth and boost transmission rates towards the 1Gbps envisaged by LTE Advanced.