Toshiba consolidates discrete, analogue and imaging production
Toshiba is to consolidate its analogue, discrete and imaging production into three manufacturing sites. Currently it has six sites.
The three plants at Himeji, Kaga and Buzen will absorb the front and back-end production operations oat Kitakyushu, Hamaoka and Mobara.
Concentration of domestic production of discrete products at three major facilities will allow Toshiba to strengthen cost competitiveness and focus on higher value added products.
The Himeji site will take on more of the development for power semiconductors and small signal devices.
Kaga will be the main facility for the power semiconductor front-end process, and will increase capacity on its current 8-inch wafer product line and expand production to include the front-end process for optical semiconductors.
Buzen will take on development for assembly and packaging technologies for optical semiconductors.
In the analogue and imaging IC businesses, Toshiba will continue to promote a shift to production on larger wafers to improve manufacturing efficiency and cost competitiveness.
Toshiba’s Oita Operations will halve production on its 6-inch wafer line during the first half of fiscal year 2012.
Other measures to increase the profitability of its analogue, discrete and imaging businesses are to accelerate the transfer of assembly and test operations to overseas facilities, outsourcing, shifting to larger diameter wafer production lines and halving its product line-up.