TSMC pushes process pedal

TSMC appears to be speeding up its scaling by scheduling 10nm tape-outs for Q1 2016, 7nm production for 2018 and 5nm introduction for 2020, according to co-CEO Mark Liu.

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Samsung says it expects to be in volume production of a 10nm chip by the end of this year.

Intel says its 10nm process has been delayed until 2017.

Intel’s 2016 capex is stated at $9.5bn, Samsung’s at $11.6bn and TSMC’s is expected to be around $9bn.

TSMC is expecting to start using EUV at 5nm,

16/20nm wafers accounted for 24% of TSMC’s revenues in Q4, and 28nm wafers accounted for 25% of revenues.

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