TI designs 3D sound device for smartphones
Texas Instruments has designed a stereo spatial audio array IC and software for smartphones and tablets.
The supplier claims it can overcome the limited soundstage of closely spaced speakers by manipulating sounds in 3D space to create a more immersive sound.
Designated the LM48903 stereo Class D spatial array, it integrates a spatial processing DSP, two Class D amplifiers, 18-bit stereo analogue-to-digital converter (ADC), phase-locked loop (PLL), and I2S and I2C interfaces.
The chip’s two Class D speaker drivers deliver 2W per channel of continuous output power into a 4ohm load with less than 1% total harmonic distortion plus noise (THD+N), said the firm.
The LM48903 is available in a 30-bump, 2.7-mm x 3.2-mm micro SMD package.
Order LM48903 samples and evaluation modules: www.ti.com/lm48903-pr
Watch a video that explains how spatial audio works: www.ti.com/spatialvid-pr.