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PiDrive from Western Digital gives Pi 300GB

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Western Digital has produced a hard disk for the Raspberry Pi 3, the PiDrive. The USB-connected 300GB drive is 7mm tall and aligns, says Western Digital, “with Raspberry Pi’s USB data and power design to reduce the electrical power load of the hard drive on Raspberry Pi, while still maintaining sufficient performance to deliver maximum USB data transfer rate.” “Upon ...

SMIC to produce RRAM

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SMIC is to manufacture Crossbar’s Resistive Random Access Memory (RRAM) for embedded applications like MCUs. SMIC will provide Crossbar RRAM blocks made on SMIC’ 40nm CMOS manufacturing process. This will enable customers to integrate low latency, high performance and low power embedded RRAM memory blocks into MCUs and SoCs. “Designers of highly integrated MCUs and SoCs need non-volatile memory technologies ...

Samsung launches 256GB V-NAND modules

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Samsung says it is mass producing a 256GB UFS embedded memory capable of storing 47 full HD movies in a module smaller than a micro SD card. “By providing high-density UFS memory that is nearly twice as fast as a SATA SSD for PCs, we will contribute to a paradigm shift within the mobile data storage market,” says Samsung executive ...

Connected car needs big memory for big data, says Toshiba

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Connected cars, with more on-board data processing, are increasing demand for automotive-qualified memory device and storage systems. How is memory technology adapting to this changing market, asks Volker Schumann The birth of automotive storage can be traced back the mid-90’s and the adoption of built-in car navigation systems in high-end cars. Since 1996, automotive specific hard disk-drives (HDDs) have steadily ...

Fujitsu samples Quad SPI FRAM

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Fujitsu is sampling a Quad SPI FRAM. By using four bi-directional I/O pins, the  device can reach a data transfer rate of 54MByte/s at an operating frequency of 108MHz. Called MB85RQ4ML, it is over four times as fast as Fujitsu’s existing parallel 4Mbit FRAM device and outperforms the 45ns parallel SRAM, the company says. MB85RQ4ML is offered in an SOP-16 package – ...

sureCore adds FDSOI memory compiler

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sureCore, the Sheffield  SRAM IP specialist, today announced the immediate availability of its 28nm FDSOI memory compiler. The compiler supports the company’s low power, single port SRAM IP and dual port SRAM IP for 28nm FDSOI process technology. It offers capacities up to 1Mbit with word lengths up to 288bits and supports 4, 8 and 16 Mux factors. According to the ...

15nm embedded NAND flash for auto

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Toshiba has launched 15nm embedded NAND flash for automotive infotainment systems and industrial applications. The technology supports an operating temperature range of -40oC to 85oC and meets AEC-Q100 specifications as well as adhering to PPAP requirements. They come in an 11.5mm x 13mm package that is compliant with the latest JEDEC eMMC standard. Densities range from 8GB to 64GB. Each ...

Renesas says 16nm finfet tech is good for cars

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Renesas Electronics says it has developed a dual-port on-chip static random access memory (SRAM) on a 16nm process. The embedded SRAM has been developed for use as video buffer memory in automotive applications such as real-time image processing capabilities necessary for future autonomous-driving vehicle technologies. “When testing the new SRAM in a 16nm process, it achieved both 688ps high-speed operation under the ...

High speed stacked memory arrives with HBM standard

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A stacked memory device which has the potential to achieve memory access speeds 14 times faster than today’s DDR4 has been demonstrated by eSilicon, Northwest Logic and SK Hynix. The stacked memory device is complaint with the JEDEC 2.5D packaging standard known as high bandwidth memory (HBM). The chip uses an FPGA-based controller core and PHY for the HBM standard architecture implemented in a Hynix ...