Latest Passive Components News

20 MP CMOS image sensor from Toshiba

Toshiba has announced a new 20-megapixel (MP) 1.12-micron CMOS image sensor (CIS) for high-end mobile handsets and smartphones with 1080p resolution…

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IQD shock-resistant oscillators

IQD has a range of very high shock survivability oscillators launched which can withstand shock levels of up to 8,000g for 0.5ms, ½ sine…

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Wearable wireless goes Bluetooth Smart

Shipments this year for wireless semiconductors in health and fitness will reach a projected 61.2 million units, up 11% from 55 million in 2013, and will increase to 95.78 million units in 2018, says IHS, while shipments  of consumer health and fitness devices with integrated wireless connectivity will…

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Rohm aims 'smallest diode' at wearables

Rohm has taken discrete semiconductor and passive component miniaturisation to a new level. The company has produced chip resistors in 03015 (0.3 × 0.15mm) size as well as Schottky barrier diodes in 0402 (0.4 × 0.2mm) size. The devices make use of a proprietary process called Rohm advanced…

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Honeywell changes magnetic sensor design, forever

Honeywell Sensing and Control has designed a position sensor IC which combines the sensitivity of an anisotropic magnetoresistive (AMR) sensor with the low power operation of a Reed switch. The range of magnetoresistive sensor ICs is called Nanopower reflecting a typical power consumption of 360nA. This is a ten-fold…

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Redux demonstrates glass loudspeaker 0.7mm thick

Redux Labs, the flat-screen audio specialist, has shown its thinnest soundbar for high-end TVs. Measuring 1.2m in length the soundbar is sized to match 55-inch TVs and is designed to achieve high fidelity audio quality from a panel of Corning Gorilla glass, just 0.7mm thick…

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