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ITF2016: Imec, Infineon team for 79GHz CMOS auto radars

Imec Infineon

This morning, in Brussels, at Imec’s ITF2016, Imec and Infineon announced a cooperation in CMOS sensor chip development. Infineon and Imec are working on highly integrated CMOS-based 79 GHz sensor chips for automotive radar applications. Imec contributes its advanced expertise in high- frequency system, circuit and antenna design for radar applications thus complementing Infineon’s radar sensor chip knowledge. As an ...

Rohde & Schwarz says LTE-Advanced uplinks ready for the network

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Rohde & Schwarz claims its TS8980 RF conformance test system has been used in the first validation for both LTE-Advanced uplink carrier aggregation (UL CA) and LTE-Advanced Pro uplink 64QAM (UL 64QAM). According to the test firm, this is an important step for extending the bandwidth and features of LTE mobile networks. Carrier aggregation and 64QAM will  support higher uplink ...

Sequans to bring LTE access to European aircraft

sequans

Sequans, the French LTE specialist, is to enable LTE in European aircraft by having its LTE chip-set inside European aeroplanes as part of the European Aviation Network (EAN) high-speed in-flight broadband access solution. The LTE access devices – called complementary ground component (CGC) terminals – will be fitted onto aircraft flying over Europe and will connect to the ground-based 3GPP ...

Scottish photonics start-up Optoscribe gets £1.2m funding

Nicholas Psaila

Edinburgh-based photonics start-up company Optoscribe has secured £1.2m in venture capital investment to fund its manufacturing plans. Optoscribe was founded in 2010 as a spin out business from Heriot Watt University, and has developed 3D photonic components for use inside communications systems in the datacoms, telecoms and mobile phone markets. The company plans to produce devices that connect optical fibres ...

UWB rides again in Insight-SIP module

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UWB rides again with an interesting application in time-of-flight measurement enabled by the Sofia-Antipolis RF packaging specialist, Insight-SIP, which is celebrating its 10th birthday today with a party for 100 people in the South of France. UWB is a relatively new departure for Insight-SIP which has based most of its product portfolio on Bluetooth LE using a Nordic Semiconductor chip-set. ...

Leti 3D chip technology gets big push from Qualcomm

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A 3D chip technology, which stacks active layers of transistors without the need for through-silicon vias (TSVs) has been developed by Leti and is the focus of a collaboration with Qualcomm. Dubbed CoolCube, the  French research centre has developed a device scale-stacking technology for complex system-on-chips such as mobile processors which is why Qualcomm is collaborating with Leti. The technology ...

Bristol University researchers claims record spectrum efficiency for 5G

Bristol 5G

A wireless antenna technology developed at the Universities of Bristol and Lund, could give 5G mobile basestations a 12-fold increase in spectrum efficiency compared with current 4G cellular technology. Multiple antenna technology, referred to as MIMO, is already used in many Wi-Fi routers and 4G cellular phone systems. Normally this involves up to four antennas at a base station. The ...

Backplane connector carries 56Gbit/s in basestations

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TE Connectivity says that its Strada Whisper direct plug orthogonal (DPO) connectors are designed to eliminate mid-plane connectivity to improve airflow in basestations and other types of communications equipment. The backplane connector supports 25Gbit/s data rates and is scalability up to 56Gbit/s (PAM4 and NRZ). The DPO connectors are designed to offer alignment and installation that maintains electrical performance even ...