The multi-chamber and multi-function system will enable research into improving the energy efficiency performance of electronic and optoelectronic devices.
The four chamber cluster system combines:
- Plasma Technology’s FlexAL Atomic Layer Deposition tool used for depositing very thin films of metals, oxides and nitrides using both thermal and inductively coupled plasma (ICP) ALD processes,
- PlasmaPro System100 ICP for etching of compound semiconductor materials and a
- PlasmaPro System100 ICP for High-Density PECVD deposition system providing for low damage, low temperature thin films;
- Omicron Nanoscience NanoSAM LAB (pictured), for surface sensitive chemical analysis and high resolution imaging of small (micro and nano) structures by Scanning Auger Microscopy (SAM) and Scanning Electron Microscopy (SEM).
According to Oxford Instruments, these systems will be combined in a unique configuration, and under vacuum, “allowing device manufacturing and characterization measurements to be performed on device interfaces and surfaces without exposure to atmosphere. This is a very exciting development for Oxford Instruments”.
The idea is that they will be used in projects to improve the efficiencies of electronic and optoelectronic devices, and to aid in the reduction of ICT energy consumption and carbon emissions. For example: “Silicon compatible GaN power electronics” and “Scalable solar thermoelectrics and photovoltaics”.
“We chose Oxford Instruments systems for a number of reasons: our long and successful collaboration history, Oxford Instruments was the manufacturer who could integrate an analysis chamber with sub-10 nm resolution for chemical analysis (essential for many nanodevices), and also because of the very strong third-party recommendations we received about the capability of their ALD system,” said Professor Douglas Paul, Director of the James Watt Nanofabrication Centre at Glasgow. We are looking forward to the extensive research opportunities this system will enable.”