Electronics Manufacturing News

Intel and IBM talk fins

Intel and IBM will present their different approaches to 14nm processes at December’s IEDM in San Francisco…

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14nm/16nm volume ramp next year, says ASML

The 14nm/16nm volume production ramp is a next-year event, says ASML CEO Peter Wennink. It had been generally thought that the new node would not be ramped in volume until 2016…

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Displays get laser treatment

Glass surface coatings can be heated to 1,000°C and be cool 100ms later using a production line laser developed by German firm LIMO. The machine has been developed to temper coatings on displays in phones and tablets, as well as anneal crystals in coatings and activate dopants. Such…

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Kyocera pushes HTCC packaging to 1000°C.

Kyocera’s ceramic packaging based on HTCC technology (High Temperature Co-Fired Ceramics), which is currently used with specific “non-magnetic” piece parts and plating options, is now being used to deliver an HTCC with platinum metallization on the top surface and in ceramic multilayering…

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3D printer can replicate itself part-by-part

RS Components is stocking the latest 3D printer from RepRapPro. Bristol-based RepRapPro has refined the original Ormerod single-colour 3D printer so that it is simpler to assemble with improved wiring looms for simple plugin connection and no soldering necessary. The Ormerod 2 uses the FFF (Fused Filament Fabrication…

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