Electronic Manufacturing News

Comment: Can Germany keep Europe in the FD-SOI game?

With FD-SOI now being proposed as the next generation semiconductor process technology, the epicentre for semiconductor manufacturing in Europe is shifting to Germany. With the eclipse of both STMicroelectronics and NXP as major European manufacturers of chips, the new momentum for investment in wafer fabs seems to be coming…

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Imec, Besi pave way to manufacturable 3D hybrid technology

Imec and Besi have developed an automated thermocompression solution for narrow-pitch die-to-wafer bonding, a method by which singulated dies are stacked onto bottom dies which are still part of a fully intact 300mm wafer. The technology paves the way to a manufacturable 2.5D, 3D, and 2…

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Future of robotics: Five things you should know about AI

From de-politicised drones to intelligent vacuum-cleaners and AI, this could be the future of robotics described in five technology predictions, writes Simon Holt. Robots have a bit of a mixed reputation in the media. One minute they’re vacuum cleaning our homes and delivering our pizzas, the next…

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GloFo launches 22FDX 22nm FD-SOI

Globalfoundries has launched a 22nm FD-SOI process called 22FDX which claims to deliver ‘finfet-like performance and energy-efficiency at a cost comparable to 28nm planar technologies’. Target markets are IoT, mainstream mobile, RF connectivity and networking. While some applications require the ultimate performance of finfet transistors, most wireless…

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Peregrine moves RF SOI to 300mm

Peregrine Semiconductor of San Diego announces UltraCMOS 11 – an RF SOI technology built on GloFo’s’ 130nm 300mm RF process. By moving to a 300mm wafer, Peregrine opens the door to new enhancements and advanced features in future generations of the UltraCMOS technology platform. UltraCMOS 11 technology uses a custom…

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Rochester to supply 68040s

Rochester Electronics has been licensed by Freescale Semiconductor to manufacture the 68040 32bit microprocessor product family which Freescale will stop producing in November. Rochester has original Freescale packaged parts and silicon die from which it will manufacture a variety of device options. Freescale has also provided access to full design…

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Imec explores life after finfets

Imec has been looking at the most promising candidates for the next process generation. Finfets will run for the 14nm-16nm node, but 7nm is expected to need a new type of transistor. The question is: which? Promising options for 7nm are Gate-All-Around Nanowire (GAA NW) finfets, which…

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Imagination preps sensor IP sub-systems for multi-node TSMC processes

Imagination is developing audio and vision sensor-based IP sub-systems consisting of blocks combining M-class MIPS CPUs with Ensigma Whisper RPUs for low-power Wi-Fi, Bluetooth Smart and 6LowPan, plus OmniShield security, eRAM and flash. TSMC will add library blocks and prepare the design for tape-out…

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