Electronics Manufacturing News

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600V GaN cascode transistors

ON Semiconductor and Transphorm have introduced  600V GaN cascode transistors and a 240W reference design that utilises them…

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Infineon and Panasonic join forces for GaN-on-Si

Infineon and Panasonic Corporation will jointly develop GaN devices based on Panasonic’s normally-off (enhancement mode) GaN on silicon transistor structure integrated into Infineon’s surface-mounted device (SMD) packages…

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French chip tech centre offers 3D silicon to universities

The French Nanoelec Research Technological Institute (IRT), headed by CEA-Leti, is offering a low cost semiconductor fabrication process with a 3D silicon capability. IRT has teamed up with chip and MEMS prototyping specialist CMP to provide a multi-project-wafer, post-process 3D integration (3D-MPW).  This uses 3D…

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Finnish firm makes 3D electronic circuits

A Finnish company which specialises in injection-molded 3D structures is offering a reference designs for its 3D structural electronics circuits. TactoTek claims that its manufacturing process makes it possible to incorporate electronics into structural plastics, including LEDs for sophisticated lighting, sensors, ICs, and printed touch controls in both rigid…

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Flexible electronics firm plans UK production

Welsh semiconductor ink firm SmartKem is teaming up with the North East’s Centre for Process Innovation (CPI) to develop flexible thin-film transistor (TFT) prototypes. The three year agreement will scale-up SmartKem activities towards foldable displays and electronics, said SmartKem, which is based at the Optical Technium in…

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EUV achieves 1000 wpd with 90W source

TSMC told the SPIE Lithography conference that it has exposed 1,022 wafers in 24 hours with an ASML NXE:3300B EUV machine with a  source power of 90W and that it has achieved several 400+ wafer per day results…

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