Electronics Manufacturing News

3D printer uses pressure control to cut costs

A pressure controlled 3D printer has raised $65,000 on the Kickstarter crowd-funding website. The Elemental 3D printer is designed to be lower cost by replacing complex mechanical operation with a pressure control system. The printer deploys a new resin-based suspension technology, which simplifies the control of resin…

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UK-China investment a focus for UK Ambassador

UK Ambassador to China, Sir Sebastian Wood highlighted UK Trade and Investment’s support for companies in the region. The Ambassador was speaking after he met with top management at Laird. Ambassador Wood travelled to Laird’s development and manufacturing centre in Shenzhen, China to learn more about the company…

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Cambridge antenna firm signs UK manufacturing deal

Cambridge-based Zinwave is to get its wideband distributed antenna systems manufactured in the UK at Plexus. The systems use a combination of photonic and wideband amplifier technology to provide in-building wireless coverage for mobile, LTE and public safety services between 150MHz-2700MHz regardless of protocol or modulation scheme…

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Flexible display technology firm opens Manchester facility

SmartKem has announced the opening of a new thin-film-transistor (TFT) fabrication and testing facility in Manchester. SmartKem supplies semiconductor materials for the manufacture of flexible displays and this production facility doubles the size of the company Together with the creation of this new device facility expansion, SmartKem will…

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Marl expands LED lighting production in Cumbria

Marl International has further increased its surface mount LED lighting production capacity in Cumbria, having invested £500,000. The new machines are customised to handle PCBs up to 1.2m long – an entire ’4 foot’ fluorescent tube replacement in one go. Capacity is now 80,000 components per hour. This…

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GUC opens up in Japan

​ Global Unichip (GUC) TSMC’s design arm, has opened a design centre in Yokohama, Japan.

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Glass seals MEMS for harsh environments

Glass with hermetic conductive through-hole vias can seal MEMS for 3D wafer-level chip size packaging (WLCSP), according to Schott of Germany. Its product is called Hermes. “Through-glass via substrates enable fully gastight and therefore long-term robust enclosures for MEMS devices,” said Schott. “The fine pitched vias…

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GloFo sets up design arm Invecas

GloFo has set up a design house called Invecas staffed with 600 engineers in Santa Clara, Bangalore, Hyderabad, and Burlington, Vermont…

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