Electronics Manufacturing News

3D printer can replicate itself part-by-part

RS Components is stocking the latest 3D printer from RepRapPro. Bristol-based RepRapPro has refined the original Ormerod single-colour 3D printer so that it is simpler to assemble with improved wiring looms for simple plugin connection and no soldering necessary. The Ormerod 2 uses the FFF (Fused Filament Fabrication…

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Raytheon and Newcastle Uni combine on SiC

Raytheon and Newcastle University are to work together to enhance the performance of SiC electronic devices, specifically for Raytheon’s own SiC CMOS process…

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Sidense proves 1T-OTP cell on 16nm finfet process

Sidense, the Ottawa developer of NV OTP IP cores, says it has demonstrated read and write capability for its 1T-OTP bit-cell architecture on test silicon fabricated on TSMC’s 16nm CMOS finfet process…

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NJR, UMC ship auto ICs

New Japan Radio Co (NJR) and UMC have begun supplying automotive ICs to major Tier-1 Japanese auto suppliers…

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Rohm offers piezo MEMS foundry

Rohm has established a process for MEMS utilising thin-film piezoelectric elements, and implemented a foundry business that integrates product design and manufacturing processes, from wafer pulling to mounting…

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NMI conference to discuss lean manufacturing

NMI, the UK’s microelectronics industry association, will hold its annual manufacturing conference at the University of Warwick on October 1st. NMI is very keen on the concepts of ‘lean’ manufacturing and the conference programme has four themed sessions: Lean 2020: Visions for Lean in the future Lean Leadership: The…

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Intel's rectangular fin is "almost a miracle", says Asenov

Intel’s 14nm process has done something which is “almost a miracle – extremely impressive,” says Asen Asenov, professor of electrical engineering at Glasgow University  and CEO of  statistical analysis specialist Gold Standard Simulations (GSS…

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