The EC is to implement a €100 billion plan to get Europe back to manufacturing 20% of the worldwide output of ICs.
“I want to double our chip production to around 20% of global production,” says Neelie Kroes, vice-president of the EC, “I want Europe to produce more chips…
Next month customers can start prototyping on STMicroelectronics’ 28nm FD-SOI process which delivers 30% better performance than 28nm bulk CMOS, according to ST’s CTO and CMO Jean-Marc Chery.
From there the planned progress down the micron trail to 14nm is dramatic: another 30% improvement at the same…
UMC, the No.3 foundry, is to spend $110m at its Singapore fab on R&D projects including CMOS image sensor backside illumination, embedded memory, high voltage applications and TSV (through silicon via) connections.
In 2013, UMC plans to increase headcount of the fab – Fab 12i – by over 80…
Toshiba will move into volume production of 64Gbit NAND flash on a 19nm process, later this month.
Toshiba reckons its 94 sq mm die is the world’s smallest for two bit-per-cell 64Gbit NAND flash.
The company also reckons it has got the world’s fastest two bit…
A way of embedding non-volatile memory in SOCs without needing to use any extra masks or process steps has been developed by eight year-old Chip Memory Technology (CMT).
CMT has developed a product it calls ‘LogicFlash’ for 180nm, 160nm and 130nm bulk CMOS logic processes.
‘LogicFlash requires no…
If you’re considering manufacturing overseas, you are almost certainly aware that you will need to deal with different cultures and accept a significant increase in delivery timescales.
However, you may want to consider a supplier closer to home as research has shown that there is a growing trend to…
SiC grew 38% in revenue terms last year to $75m, reports Yole Développement, with 30 companies now able to manufacture SiC devices in their own facilities.
Four companies have set up as SiC foundries: Fraunhofer, Ascatron, ISB and Raytheon.
Last year four companies ramped production aggressively – Rohm, ST, GeneSIC…
MOSIS, the multi-project wafer organisation, is to supply low-cost, low-volume photonic ICs.
MOSIS is supplying photonics ICs via a co-operation with Imec, the Tyndall National R&D Institute of Ireland and ePIXfab – the European Silicon Photonics Platform co-funded by the consisting of the Imec…