Electronics Manufacturing News

Displays get laser treatment

Glass surface coatings can be heated to 1,000°C and be cool 100ms later using a production line laser developed by German firm LIMO. The machine has been developed to temper coatings on displays in phones and tablets, as well as anneal crystals in coatings and activate dopants. Such…

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Kyocera pushes HTCC packaging to 1000°C.

Kyocera’s ceramic packaging based on HTCC technology (High Temperature Co-Fired Ceramics), which is currently used with specific “non-magnetic” piece parts and plating options, is now being used to deliver an HTCC with platinum metallization on the top surface and in ceramic multilayering…

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3D printer can replicate itself part-by-part

RS Components is stocking the latest 3D printer from RepRapPro. Bristol-based RepRapPro has refined the original Ormerod single-colour 3D printer so that it is simpler to assemble with improved wiring looms for simple plugin connection and no soldering necessary. The Ormerod 2 uses the FFF (Fused Filament Fabrication…

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Raytheon and Newcastle Uni combine on SiC

Raytheon and Newcastle University are to work together to enhance the performance of SiC electronic devices, specifically for Raytheon’s own SiC CMOS process…

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Sidense proves 1T-OTP cell on 16nm finfet process

Sidense, the Ottawa developer of NV OTP IP cores, says it has demonstrated read and write capability for its 1T-OTP bit-cell architecture on test silicon fabricated on TSMC’s 16nm CMOS finfet process…

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NJR, UMC ship auto ICs

New Japan Radio Co (NJR) and UMC have begun supplying automotive ICs to major Tier-1 Japanese auto suppliers…

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Rohm offers piezo MEMS foundry

Rohm has established a process for MEMS utilising thin-film piezoelectric elements, and implemented a foundry business that integrates product design and manufacturing processes, from wafer pulling to mounting…

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