Toshiba offers European foundry service for medium volumes
Toshiba Electronics is offering European Asic customers a foundry manufacturing service on 8-inch (200mm) CMOS wafers which combines support for special processes, process modifications and bespoke process development for medium- and high-volumes.
The available process nodes are 0.6µm, 0.35µm, 0.18µm, 0.13µm, 110nm and 90nm. Standard IP options range from logic and embedded memory (SRAM, ROM, EEPROM and Flash EEPROM) to CMOS sensors with a variety of pixel sizes.
High-voltage CMOS and DMOS processes are available for designs demanding higher power operation.
There also options for special wafer substrates, custom-specific process modules, special implant- and diffusion process conditions and custom layer stacks.
Toshiba is also offering non-standard post-processing steps such as ‘through-silicon-vias’, protection films, optical films and micro-lenses.
The foundry service also covers wafer probing and light/dark testing in Toshiba’s fab in Iwate, Japan. This facility is fully certified in accordance with ISO14001, TS16949 and OHSAS18001.