X-Fab has open platform MEMS 3D inertial sensor process for prototyping
X-Fab has an open-platform MEMS 3D inertial sensor process available for engineering services and early access prototyping, with full qualification and complete design rule access coming early in 2013.
Customers can run their own designs on the process or use X-Fab’s design partner, and immediately run wafer volumes without process development.
The process is suitable for applications such as mobile devices, consumer goods, games and toys, automotive, robotics, industrial and medical equipment that use 3D accelerometers or gyroscopes.
One-axis and 2-axis designs can be produced with the same process.
Accelerometer and gyroscope designs also can be placed side by side on a single chip made with the same process, enabling the manufacture of 6DoF IMU.
“We are shifting the paradigm from the limiting ‘one product, one process‘ rule to the open platform approach of giving any company access to a process that can be used for multiple applications,” says X-Fab’s Iain Rutherford.
X-Fab’s technology has single-crystal silicon for inertial masses and drive-combs, proprietary buried contact technology that supports complex metal interconnects using a single metal layer, low parasitic capacitance and EMI protection.
The 3D inertial sensor process complements X-Fab‘s established 1D/2D inertial sensor, pressure sensor and infra-red thermopile open-platform processes in use by X-FAB customers since 2003, and its ready-made IP blocks for 2G, 10G and 100G accelerometers.
The 3D inertial sensor technology was developed using X-Fab’s step-by-step
qualification procedures to ensure the process is characterised, stable, and