Cypress claims its SONOS embedded nonvolatile memory (NVM) process requires fewer additional mask layers to insert it into a standard CMOS process, specifically, three to four additional masks.
The Taiwan-based foundry qualified Cypress’s S65 65-nm SONOS process technology back in 2013. Cypress and UMC have demonstrated the ability to scale SONOS to smaller nodes, expediting future IP development.
“Based on UMC’s previous success for specialty processes such as RF, BCD, HV, CIS and eFlash technologies, we plan to leverage Cypress’s easily integrated nonvolatile memory IP at 55nm to fulfill different application requirements for nonvolatile memory IP specifications,” said S.C. Chien, vice president of Specialty Technology Development at UMC.
Typical applictaions fo rembedded flash include smart cards, bank cards and wearables.