Electronics Research News

Server power measured per programme

Aiming to cut power waste in data centres, Fujitsu Labs has developed a way to determine how much energy each programme running on a CPU consumes. It adds to the capability,¬†called RAPL, of some Intel CPUs to measure overall power consumption. “According to a report by the Japanese Ministry…

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In depth: NASA's passive Wi-Fi saves 80% power

NASA has revealed a technique which dramatically cuts the power consumption of Wi-Fi comms, at least at the remote terminal. Key is modifying the Wi-Fi base station to allow the transmitter of the remote terminal to be replaced by a modulated passive reflector. “In a Wi-Fi radio…

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Wize Mirror reads back vital signs

Mirror mirror on the wall, am I at risk of heart disease? One day soon your mirror might actually be able to give you the answer. Wize Mirror looks like a mirror, but incorporates 3D scanners, multispectral cameras and gas sensors to assess the health of someone looking into it…

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Cardiff gets new multi-million pound semiconductor centre

The UK is bidding to be a world-leading centre for research and production of compound semiconductors which are used in optoelectronics and power systems. IQE, the semiconductor wafer foundry, is creating a joint venture with Cardiff University for the development and commercialisation of compound semiconductor technologies. The JV will…

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Algorithm designs previously unknown optical components

A mathematical technique borrowed from the stock market can design the working parts of integrated silicon waveguide optical components, using only the required specification as input data, claim scientists from Stanford University. To design their device they adapted concepts from ‘convex optimisation’, with the help of Stanford electrical engineering Professor…

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Molecule opens window on single-electron transistors

An international team has made single-electron transistors – a transistor from a molecule of phthalocyanine and twelve indium atoms. An alternative to ‘single electron’ transistors made on fabricated quantum dots – which are sensitive to one electron leaving or joining, but typically have hundreds of electrons – this transistor is simple and…

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Imec and SPTS join on TSV

Imec and SPTS Technologies are developing a short cycle-time dry silicon removal and low temperature passivation solution for through-silicon via-middle processing and thinning of the top-wafer in wafer-to-wafer bonding. Wafer backside processing is critical for 3D-IC wafer stacking. Through-silicon vias (TSV) formed…

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