Electronics Research News

Cardiff gets new multi-million pound semiconductor centre

The UK is bidding to be a world-leading centre for research and production of compound semiconductors which are used in optoelectronics and power systems. IQE, the semiconductor wafer foundry, is creating a joint venture with Cardiff University for the development and commercialisation of compound semiconductor technologies. The JV will…

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Algorithm designs previously unknown optical components

A mathematical technique borrowed from the stock market can design the working parts of integrated silicon waveguide optical components, using only the required specification as input data, claim scientists from Stanford University. To design their device they adapted concepts from ‘convex optimisation’, with the help of Stanford electrical engineering Professor…

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Molecule opens window on single-electron transistors

An international team has made single-electron transistors – a transistor from a molecule of phthalocyanine and twelve indium atoms. An alternative to ‘single electron’ transistors made on fabricated quantum dots – which are sensitive to one electron leaving or joining, but typically have hundreds of electrons – this transistor is simple and…

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Imec and SPTS join on TSV

Imec and SPTS Technologies are developing a short cycle-time dry silicon removal and low temperature passivation solution for through-silicon via-middle processing and thinning of the top-wafer in wafer-to-wafer bonding. Wafer backside processing is critical for 3D-IC wafer stacking. Through-silicon vias (TSV) formed…

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Oxford makes graphene crystals in just 15 minutes

Millimetre-sized high-quality graphene crystals can be made in minutes instead of hours, claim researchers from Oxford University. The team says it has demonstrated the production of large graphene crystals around 2-3 millimetres in size in just 15 minutes, instead of the more typical 19 hours to produce…

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CEA-Leti demonstrates high density finfets

CEA-Leti has announced first results towards the demonstration of a finfet technology which stacks in 3D active layers of transistors in greater density. The sequential integration technology called CoolCube can potentially be produced in finfet technology on CEA-Leti’s 300mm production line. “Key process steps developed on 300mm…

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Harvard 3D-printed robot jumps six times its height

Engineers at Harvard University have created a 3D-printed robot that can leap about six times its own height. The secret to its success? It’s made from a combination of soft and rigid parts. Soft robots are more adaptable, safer, and more resilient than stiff metal machines, say the…

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