European project develops high density capacitors for cars
CEA-Leti, Fraunhofer IPMS-CNT has joined with three Europe-based companies – IPDiA, Picosun and Sentech Instruments in a project to commercialise high-density 3D integrated capacitors.
The two-year, EC-funded PICS project is designed to develop very high capacitor densities of over 500nF/mm2, along with higher breakdown voltages.
Eventual applications will include automotive, medical and lighting.
“For these applications, passive components are no longer commodities,” said the project team.
Capacitors have been identified as key components in electronic modules, and high-capacitance density is required to optimise power-supply and high decoupling capabilities. Dramatically improved capacitance density also is required because of the smaller size of the package.
France-based IPDiA has developed an integrated capacitors technology that out performs current technologies (e.g. tantalum capacitors) in terms of stability in temperature, voltage, aging and reliability.
“Now, a technological solution is needed to achieve higher capacitance densities, reduce power consumption and improve reliability. The key enabling technology chosen to bridge this technological gap is atomic layer deposition (ALD) that allows an impressive quality of dielectric,” said the team.
For the industrial partners, Picosun of Finland will develop ALD tools adapted to IPDiA’s 3D trench capacitors. Germany-based Sentech Instruments will provide a system to accurately etch high-K dielectric materials.
The PICS project has received funding from the European Union’s Seventh Framework Program managed by REA-Research Executive Agency.