Electronics Process R&D News

Cardiff gets new multi-million pound semiconductor centre

The UK is bidding to be a world-leading centre for research and production of compound semiconductors which are used in optoelectronics and power systems. IQE, the semiconductor wafer foundry, is creating a joint venture with Cardiff University for the development and commercialisation of compound semiconductor technologies. The JV will…

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Imec and SPTS join on TSV

Imec and SPTS Technologies are developing a short cycle-time dry silicon removal and low temperature passivation solution for through-silicon via-middle processing and thinning of the top-wafer in wafer-to-wafer bonding. Wafer backside processing is critical for 3D-IC wafer stacking. Through-silicon vias (TSV) formed…

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Oxford makes graphene crystals in just 15 minutes

Millimetre-sized high-quality graphene crystals can be made in minutes instead of hours, claim researchers from Oxford University. The team says it has demonstrated the production of large graphene crystals around 2-3 millimetres in size in just 15 minutes, instead of the more typical 19 hours to produce…

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CEA-Leti demonstrates high density finfets

CEA-Leti has announced first results towards the demonstration of a finfet technology which stacks in 3D active layers of transistors in greater density. The sequential integration technology called CoolCube can potentially be produced in finfet technology on CEA-Leti’s 300mm production line. “Key process steps developed on 300mm…

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Cambridge claims world's most precise weld

What is claimed to the world’s smallest weld in thermoplastic material could be used in lab-on-a-chip devices. The welding technique was enabled by electron beam lithography involving laser welding along absorber dye patterns has been developed by TWI in collaboration with the University of Cambridge. Laser…

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European project develops 3D LEDs in gallium nitride

The European GECCO project is investigating the use of gallium nitride (GaN) LED lighting devices which it claims are more efficient and environmentally-friendly than conventional light sources, “and therefore contribute significantly to a sustainable energy saving and carbon footprint reduction”. To support this research work is focusing on developing…

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Imec gets closer to directed self-assembly

Imec, Tokyo Electron and Merck have developed a directed self-assembly (DSA) process for a via patterning process compatible with the 7nm technology node and have significantly improved DSA defectivity to 24 defects/cm2…

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Cambridge firm creates first flexible OLED display

Cambridge start-up FlexEnable claims to have made a breakthrough in printable electronics which will see flexible displays in volume production by the end of the year. The company has been in stealth mode for two years developing a process for making plastic electronic circuits that can be printed in…

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