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Process R&D

US firm patents flexible organic thin-film for smartphone displays

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A US-based thin-film technology developer says it has been granted a US patent for technology invented by Ashok Chaudhari and based on the work of the late Dr. Praveen Chaudhari, winner of the 1995 US Medal of Technology. The company Solar-Tectic LLC has developed the hybrid organic/inorganic thin-film which can be grown on inexpensive substrates, such as flexible and ordinary ...

CEA-Leti believes FD-SOI chips work better under pressure

Maud Vinet

French research centre CEA-Leti believes it has developed a semiconductor process technology technique which will produce faster ICs using FD-SOI (fully-depleted silicon on insulator) processes. The Grenoble-based centre has developed two techniques to induce local strain in FD-SOI processes and it believes the result will be faster chips with no power penalty. The techniques apply compressive strain to silicon germanium (SiGe) ...

Workshop will present research into quantum computing

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Oxford Instruments is running a one day workshop on ‘Processing for Quantum Computing’, in Delft, the Netherlands on 11th November 2015. The workshop, which is free, will present recent progress in quantum computing, plus future trends in its development and application. Dr Frank Dirne, managing director of tquantumhe Kavli Nanolab Delft comments: “As the exciting area of quantum research develops into ...

Cardiff gets new multi-million pound semiconductor centre

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The UK is bidding to be a world-leading centre for research and production of compound semiconductors which are used in optoelectronics and power systems. IQE, the semiconductor wafer foundry, is creating a joint venture with Cardiff University for the development and commercialisation of compound semiconductor technologies. The JV will work closely with Cardiff University’s Institute of Compound Semiconductors (ICS), which ...

Imec and SPTS join on TSV

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Imec and SPTS Technologies are developing a short cycle-time dry silicon removal and low temperature passivation solution for through-silicon via-middle processing and thinning of the top-wafer in wafer-to-wafer bonding. Wafer backside processing is critical for 3D-IC wafer stacking. Through-silicon vias (TSV) formed using ‘via-middle’ processing, are typically exposed from the backside of 300mm device wafers by a combination of mechanical ...

Oxford makes graphene crystals in just 15 minutes

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Millimetre-sized high-quality graphene crystals can be made in minutes instead of hours, claim researchers from Oxford University. The team says it has demonstrated the production of large graphene crystals around 2-3 millimetres in size in just 15 minutes, instead of the more typical 19 hours to produce using current chemical vapour deposition (CVD) techniques. The is another example of the research ...

CEA-Leti demonstrates high density finfets

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CEA-Leti has announced first results towards the demonstration of a finfet technology which stacks in 3D active layers of transistors in greater density. The sequential integration technology called CoolCube can potentially be produced in finfet technology on CEA-Leti’s 300mm production line. “Key process steps developed on 300mm wafers show progress in closing the gap between the demonstration of a single device and taking the ...

Cambridge claims world’s most precise weld

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What is claimed to the world’s smallest weld in thermoplastic material could be used in lab-on-a-chip devices. The welding technique was enabled by electron beam lithography involving laser welding along absorber dye patterns has been developed by TWI in collaboration with the University of Cambridge. Laser welding of plastics is used in the manufacture of products such as microfluidic devices, where channels ...

European project develops 3D LEDs in gallium nitride

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The European GECCO project is investigating the use of gallium nitride (GaN) LED lighting devices which it claims are more efficient and environmentally-friendly than conventional light sources, “and therefore contribute significantly to a sustainable energy saving and carbon footprint reduction”. To support this research work is focusing on developing white LEDs with higher efficiencies and lower cost per lumen. The ...