Soitec and Shin-Etsu Handotai up supply of SOI for finfets
Soitec, the France-based semiconductor materials manufacturer has teamed up with Shin-Etsu Handotai to support the development and wafer supply of silicon-on-insulator (SOI) wafers to be used in finfets on SOI and Fully Depleted (FD) planar circuits.
The firms claim this will be an important increase global output of SOI wafers at a time when the technology is in demand.
“We are very excited about the business opportunities for SOI products, and we look forward to working with Soitec to extend the global supply chain for new products, such as FD-SOI and SOI for FinFETs, which are showing potential benefits in mobile and embedded applications,” said Nobuo Katsuoka, SEH director, SOI process engineering department.
“It is a critical time in the electronics industry, and there is an increasing need for new and innovative wafer materials that extend the performance and energy efficiency of consumer devices we all use every day,” said Paul Boudre, COO of Soitec.
Shin Etsu Handotai was the first company to license Soitec’s Smart Cut technology and signed a long term alliance with Soitec in 1997, in which the company had granted to SEH a license to use the Smart Cut technology for the manufacture and sale of SOI wafers.
“We have worked side by side with SEH for more than 15 years, and together we have established Smart Cut as the industry standard for manufacturing SOI,” said Boudre.
“The unique features of Smart Cut will enable our two companies to jointly improve global output for existing and new SOI products,” said Katsuoka.