Semikron has an IGBT module for 22kW to 150kW converters in electric and hybrid vehicles, which it claims is entirely solder-free.

According to the supplier, this means the module can have a five times higher temperature-cycling capability than modules that use a base plate and soldered terminals.

"While some power semiconductor manufacturers are still working on soldered contacts to meet the high temperature requirements of the automotive industry, solder-free pressure contact technology and sintered chips offer the optimal solution to increase the temperature cycling capability to 10,000 cycles at delta 100K," said Semikron.

The high temperature capabilities of Tjunction (175°C) and Tambient (135°C) allow one dedicated coolant loop to be omitted.

The solder-free pressure system and an internal laminated bus bar provide a homogeneous current distribution. Every IGBT and diode chip has its own connection to the main terminal.
The chips are sintered to achieve the high power-cycling capability. The sinter joint is a thin silver layer that has a superior thermal resistance to a soldered joint and, due to the high melting point of silver, no joining fatigue, which leads to an increased
service life.

Two case sizes are available SKiM 63 (120x160mm) and SKiM 93 (150x160mm).

See www.semikron.co.uk