Mosis, a prototyping and small volume Asic production service provider, is offering IBM’s image sensing technology through its multi-project wafer (MPW) service.

Capable of cutting the cost of embedded image sensor technology, the MPW service, which is available in the UK through EDA Solutions, is based on 8-inch wafers with a reticule size of 18x20mm. Approximately 60 reticule copies are stepped on the wafer. Typical turn-around time from release of the design to manufacturing is less than 60 days.

“The growth in demand for colour imaging continues to accelerate as it becomes more affordable in an ever-widening range of consumer electronic products. This new MPW service gives imaging system designers access to affordable prototyping and low volume production,” said Wes Hansford, Mosis deputy director.

The IBM CIMG7SF process utilises180nm technology to produce a 4-transistor, 3.0[micro]m reference pixel. It incorporates integrated colour filters and webbed microlenses which have clear benefits for quantum efficiency and viewing angles.

The surface area that is sensitive to light is maximised, allowing adjacent microlenses to overlap, and photodiode technology minimizes dark current. The process uses aluminium for the last metal layer and copper wiring for the remaining metal layers. Thin back end-of-line metal stacks and good dielectric tolerance make the process suitable for most imaging requirements.