Toshiba Electronics Europe (TEE) has announced that the company’s renowned process technology and its Universal Array system-on-chip (SoC) design platform have played a key role in the development of a next generation 200Mbps powerline communications (PLC) IC from DS2, the leading supplier of Universal Powerline Association (UPA) technology.

The  DSS9101U SoC, part of DS2’s new two-chip ‘Aitana’ solution, brings new levels of powerline performance to multimedia applications including home media networks, in-building LANs, and low and medium voltage powerline access networks. By basing its design on Toshiba’s renowned process technology, DS2 has been able to combine high-performance, low-power operation with very high levels of integration for maximum on-board functionality.

The new IC was developed in conjunction with Toshiba’s European LSI Design and Engineering Centre (ELDEC) in Düsseldorf. In order to minimise time from design concept to full production, ELDEC engineers used Toshiba’s Universal Array SoC development platform. This flexible platform speeds development time and can accommodate design changes at much later stages in the process than conventional methodologies.

During the development of the IC Toshiba’s engineers implemented a number of on-board features including the advanced custom ADCs and DACs that play a key role in helping the DSS9101U to deliver its 200Mbps operation.  A high-performance PLL function and a variety of proven and qualified analogue IP blocks from Toshiba’s IP library were also integrated within the chip.

Discussing the development, Jorge Blasco, president and CEO of DS2, comments: “From IPTV applications such as room-to-room HD video streaming to retail requirements for powerline adapters, the demand for high-performance powerline chips is growing rapidly. The guarantee of quality that comes with a Japanese brand like Toshiba was a critical factor for us. The combination of advanced, low power process technology, local engineering support, and a platform that dramatically cut development time were all key factors in selecting Toshiba as a partner in developing the next generation of IC to address this demand.”

Armin Derpmanns, general manager of the System on Chip (SoC) Business Unit at TEE states: “Toshiba’s advanced IDM business model is perfectly matched to the requirements of fabless chip makers such as DS2. Our local ELDEC engineers were well positioned to provide DS2 with the design, implementation, consultancy and project management support they needed, while the technology and design platform allowed DS2 to meet key criteria relating to performance, power, on-board functionality, cost and time-to-market.”

Mr Tsutsui, senior manager from Toshiba Semiconductor Company, Custom SoC group in Japan adds: “Toshiba is committed to growing its custom SoC business and the DS2 development is a perfect example of how we are well placed to support fabless chip companies at all stages of the design, development and manufacturing process.”

Further information

For further information, contact Toshiba Electronics Europe on +49 (0) 211 5296 0 or info@toshiba-components.com.