Aavid Thermalloy’s heatsinks for standard 1/8 brick form factor power modules are ready for mounting with interface material pre-applied for easy assembly.
The heatsinks feature thin fin geometry to improve thermal performance. According to the supplier, the use of thinner fins can improve system airflow and hence lower fan cooling requirements.
Models are available in both lengthwise and crosswise airflow directions and come in three different heights to match the application.
Agilent Technologies
Analog Devices
Harting
LEM
Maxim Integrated Products
NXP
Rohde & Schwarz
Tektronix
Toshiba
Yokogawa