TTI, a passive and connector specialist, has announced availability of the Tyco Z-PACK TinMan Backplane Connector family, aimed at users searching for a high density, high performance backplane interconnect system.

According to TTI, the Z-PACK TinMan connector design offers a fully protected right-angle receptacle for use on daughter cards where handling damage can be a concern when mating to a vertical male header.

Ground contacts positioned within each column of the connector, combined with unique contact lead frame arrangements, enable the Z-PACK TinMan connector to achieve low crosstalk and high through-put performance levels, states the company.

To help assure reliability, there is a dual point of contact mating interface and compliant pin interface to the printed circuit board.

Featuring a 10+ Gb/s performance, the connector range has 100 Ω impedance for differential pair configuration, and several versions meeting standard card slot pitches.

The Z Pack TinMan modular system, in various column versions, right angle pin header (coplanar -3, -4, -5 pair) and vertical receptacles (parallel port -4 pair), has sequencing for ground and signal contacts, and is RoHS compliant.

See www.ttieurope.com