RF Micro Devices has developed an RF shielding technology, MicroShield, which is integrated inside the IC or module.

The result, claimed the supplier, is a reduction in package height and volume by up to 25 per cent and 50 per cent, respectively.

Called MicroShield, the RF shielding technology is designed to remove the need for external shields by integrating RF shielding directly into the RFIC or module.

This compares with traditional RF shielding which is implemented with external metal "cans" that encapsulate and shield the RF section of a circuit board.

According to RFMD, this technique "minimises exposure to external fields and preventing energy leakage into unwanted areas of the host device. An added benefit is that an RF device's sensitivity to board placement can be reduced. 

Aimed at mobile handset manufacturers, the MicroShield technology is applicable to any over-molded packaging technology and is first available in RFMD's Polaris 3 chipset.

See www.rfmd.com