Teknoflex has extended its range of flexible surface mount interconnects (SMIs) with the introduction of a 0.50mm pitch version in seven different standard configurations.

SMIs, which are supplied in industry standard tape and reel packaging, have been adopted in wide ranging applications including automotive, avionics, defence, consumer, medical and communications products.

The interconnects can be placed along with all other surface mount components, linking several elements of rigid circuit boards together. Once the assembly process is complete the circuit boards can be snapped, or routed, from the main board and then folded and assembled into the unit.

The approach provides a flexible board-to-board interconnection method, as an alternative to techniques such as flexible rigid multilayer.

Figure 1 shows a number of surface mount interconnects assembled onto rigid PCBs which are then folder into a three dimensional, package. The SMI requires no fixing or mounting holes and is a low profile and light weight method of board to board interconnection.

See www.teknoflex.com