Molex and Neoconix have partnered to deliver a flexible, copper-based high-density and speed (HD&S) interposer. The low-profile contact interface integrates Molex Copper Flex with Neoconix’s HD&S [1]PCBeam interposer for flex-to-PCBA applications.

“Molex and Neoconix have come together to develop a highly-reliable interface that allows differential signal speeds greater than 10Gbps and single-ended speeds of 4GHz and higher,” said Gary Manchester, Director of Marketing, Molex, Integrated Products division.

“With less than 3% crosstalk in a pin-matrix configuration, the Copper Flex assembly with PCBeam interposer will provide consistent, high-speed data transmission with minimal interference.”

The Copper Flex assembly provides a variety of pin-matrix configurations, with densities of 1.00mm or less, to allow for board-to-flex pin counts of 500 I/Os or greater. Single-piece compression and tool-less hardware interfaces are available; as well as an impedance matched system that offers 100Ω differential and 50Ω single-ended options.

PCBeam interposers feature all-metal spring beams that are permanently embedded onto an FR-4 substrate in a high-density configuration. Photolithography and etch are used to define the contact elements, enabling design flexibility and true-position accuracy.

Typical configurations provide 0.152mm of true electrical compliance (TEC) per side at 1.00mm pitch to ensure high reliability. An innovative dual-beam option is also available to provide contact redundancy in high-reliability applications.

Copper Flex assemblies with PCBeam interposer are available in flexible cable lengths of 4 to 28 inches for complete design flexibility, and are offered in a variety of thicknesses and custom array of sizes and footprints.

Further details

For additional information on Molex's Copper Flex assembly with HD&S PCBeam interposer, please visit www.molex.com/link/copperflexassy.html. For more technical information on Neoconix's HD&S PCBeam interposer, please visit: www.neoconix.com.