Renesas Technology Europe SH74504 and SH74513 32-bit MCUs with embedded flash memory have been developed for automotive driver-assist systems such as those capable of obstacle detection and collision avoidance.

Designed around Renesas’ SH-4A CPU core, the devices combine 2Mbytes (SH74504) /1.5Mbytes(SH74513) of embedded flash memory and 512Kbytes of on-chip SRam. They allow high-speed processing of sensor data such as that captured by radar or onboard cameras.

The ICs offer three direct Ram input interface (DRI) channels which allow sensor data to be written direct to Ram without incurring any CPU overheard. The DRI feature supports direct parallel connection at up to 40 Mbps, from a CMOS camera with a maximum of wide video graphics array (WVGA) resolution, to on-chip SRam as a camera interface for the lane departure warning system (LWDS). Also, a single channel I2C function is provided for camera settings.

Other on-chip peripheral functions include a parallel DAC controller (PDAC) circuit for controlling the D/A converter required by a driver-assist system employing radar, a parallel selector (PSEL) circuit for channel control of a high-speed A/D converter (ADC), a DRI circuit ideal for capturing data from a high-speed external AD converter, a TOU timer for controlling a brushless DC motor (BLDC) for mechanical radar scanning control, and a 65-channel ATU-III (Advanced Timer Unit III) multifunction timer unit suitable for timing control.

Fabricated using 90-nm process technology, both the SH74504 and SH74513 have an on-chip floating-point processing unit (FPU) with a maximum operating frequency of 240 MHz. The FPU supports single- and double-precision calculations and achieves a maximum operation performance of 1.68Gflops in single-precision mode. Hardware support for vector and sine or cosine arithmetic computations translates into high-speed calculation processing.

The SH74504 and SH74513 employ 17 × 17 mm BGA package that has a mounting area about 30% smaller than earlier LQFP product from Renesas Technology. This package has multiplexed pins that can be assigned to more than one function.

The number of functions per pin has been increased to six from four to provide support for a wider range of applications. The compact BGA package has a 0.8 mm pin pitch and an operating temperature range extending up to 125°C.

More information: www.renesas.eu