Lattice Semiconductor is offering automotive temperature qualified (AEC-Q100) chip scale 132 BGA (ball grid array) packaging for its non-volatile LatticeXP2 FPGA family.

The Chip Scale 132 BGA packaging has been fully qualified and characterized to meet AEC-Q100 requirements from the Automotive Electronics Council, and is available for the XP2-5 and XP2-8 devices, with five thousand and eight thousand LUTs (Look Up Tables) available, respectively.

Based on 90nm technology, the FPGA family's chip scale packaging is intended for automotive applications such as automotive camera modules, telematics systems, parking assistance systems and multimedia systems.

Measuring 64mm sq. and 1.35mm in height, the package footprint is the smallest available for non-volatile FPGAs.