Microsemi has introduced a DDR3 SDRAM memory device that is packaged in a single plastic ball grid array (PBGA) and offered as a compact x64/x72 unregistered dual in-line memory module (UDIMM )/small outline dual in-line memory module (SODIMM).

It provides up to 4Gbyte compact memory densities for processor-based designs in mission-critical applications such as avionics, UAVs, missile systems and other defence applications that require high reliability in harsh environments.

Microsemi’s commercial off-the-shelf (COTS) DDR3 SDRAM devices give customers a standalone, high-density memory solution that also meets the data widths necessary for many applications.

According to the supplier, the DDR3 devices can reduce space requirements as compared to systems built from discrete memory components.

www.microsemi.com