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Texas Instruments Technical Resources - Embedded Processors (Microcontrollers and DSPs)

Texas instruments logo 300.jpgYou Design. We Help. The TI Technical Resources Centre on Electronics Weekly provides design engineers with access to resource guides, videos, articles and catalogues that provide you with valuable information on TI's services, product offerings, product applications and expertise. This is the Embedded Processors (Microcontrollers and DSPs) section.

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Videos

Audio Capacitive Touch BoosterPack for MSP430 LaunchPad New Audio Capacitive Touch BoosterPack for MSP430 LaunchPad
The Audio Capacitive Touch BoosterPack (430BOOST-C55AUDIO1) is a plug in board for the $4.30 MSP430 Value Line LaunchPad development kit. The Audio Capacitive Touch BoosterPack is ideal for low-power applications that use record and playback audio functions such as MP3 players, home automation and industrial applications. Watch this video to learn more about this exciting new development tool.

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Get Started Quickly with Audio Capacitive Touch Boosterpack New Piccolo Control Law Accelerator Debug in CCS 3.3 Training
The C5535 ultra-low-power digital signal processor-based BoosterPack is a plug-in board for the MSP430™ microcontroller LaunchPad development kit, and is the first solution from TI where the DSP is solely controlled by a microcontroller. The BoosterPack adds DSP functionality to your microcontroller applications without losing the low power feature. Watch this out-of-box experience video to get started today!

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Getting Started with the MSP430 5xx Experimenters Board - Part 3 Training New Getting Started with the MSP430 5xx Experimenters Board - Part 3 Training
This section covers a mixed signal application example.

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Getting Started with the MSP430 5xx Experimenters Board - Part 4 Training New Getting Started with the MSP430 5xx Experimenters Board - Part 4 Training
This section shows how to use the hardware timers to conserve power.

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Getting Started with the MSP430 5xx Experimenters Board - Part 5 Training New Getting Started with the MSP430 5xx Experimenters Board - Part 5 Training
This section shows how to implement a fully optimized ADC12 routine.

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Piccolo Control Law Accelerator Debug in CCS 3.3 Training New Piccolo Control Law Accelerator Debug in CCS 3.3 Training
This video provides an introduction to debugging the C2000 Piccolo Control Law Accelerator (CLA) in Code Composer Studio V3.3.

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Piccolo Control Law Accelerator Example Framework Training New Piccolo Control Law Accelerator Example Framework Training
This video provides walk-through of a sample code framework that can be used to add CLA functionality to your application.

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Piccolo Microcontrollers for Digital LED Lighting Control Training New Piccolo Microcontrollers for Digital LED Lighting Control Training
OVERVIEW LEDs promise to bring more efficiency, lower cost, and more features. Digital LED control will help achieve these goals by adding more intelligence to the system. With one Piccolo microcontroller, advanced features such as power line communication, precise dimming, color mixing, and fault detection can be implemented in an LED lighting system. This session will cover the basics of LED lighting, explain how digital control can be implemented, and look at the development tools TI offers to kick start LED designs.

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Ultra Low Power Wireless Sensor Network for Home Automation New Ultra Low Power Wireless Sensor Network for Home Automation
Learn how to design a low-power wireless sensor network using TI's ultra-low-power microcontroller, low-power radio transceiver and ultra-low-power software protocol, for home and industrial automation.

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C5000 Audio Capacitive Touch BoosterPack - Software Overview New C5000 Audio Capacitive Touch BoosterPack - Software Overview
The Audio Capacitive Touch BoosterPack (430BOOST-C55AUDIO1) is a plug in board for the $4.30 MSP430 Value Line LaunchPad development kit. The Audio Capacitive Touch BoosterPack is ideal for low-power applications that use record and playback audio functions such as MP3 players, home automation and industrial applications. This video is an overview of the Launchpad Host Application software - which takes user inputs and controls the C553x DSP on the Audio Boosterpack. Watch today to learn more!

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Smart Energy Profile Demonstration (SEP 2.0) New Smart Energy Profile Demonstration (SEP 2.0)
A Smart Grid system solution: SEP2.0 is an IP-based application specification under development by the ZigBee and WiFi Alliances along with other industry groups. SEP2.0 has also been identified by the National Institute of Standards and Technology as the recommended protocol for energy information and control in the Home Area Network, or HAN.

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StellarisWare Advanced - Taking your knowledge to the next level StellarisWare Advanced - Taking your knowledge to the next level
In this advanced session, we will cover the specific components that make up StellarisWare. StellarisWare component that will be covered include Stellaris Peripheral Driver Library, USB library, graphics library, serial flash loader and boot loader. In addition, we will review the rich set of code examples provided in the Stellaris family and the in-system programming support.

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Robust Sensor Networks With Hybrid PLC/RF Nodes Robust Sensor Networks With Hybrid PLC/RF Nodes
Robust sensor networks for home or industry automation with TI’s leading power line communication and low power radio technologies.

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Piccolo CLA Technical Overview Piccolo CLA Technical Overview
This technical overview of the Piccolo TMS320F2803x Control Law Accelerator (CLA) describes how the independent, 32-bit floating-point math accelerator runs in parallel with the C28x core. The CLA can perform low level control loops (32-bit accurate) with.

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Mission Possible: Exploring Sitara AM335x ARM Processor Mission Possible: Exploring Sitara AM335x ARM Processor
Need a highly integrated, cost optimized, ARM processor? Introducing the Sitara ARM Cortex-A8 processor at the cost and power levels of an ARM9.

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Integrated USB Connectivity with MSP430 MCUs Integrated USB Connectivity with MSP430 MCUs
Modern MSP430s have integrated USB peripherals allowing for serial communication over a single plug and play cable, intelligent human interface devices like mice and keyboards that don’t require driver installation, or mass storage devices for data retention. MSP430 devices that feature a USB peripheral will be discussed as well as the software USB stacks required to create USB applications.

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Getting Started with the MSP430 LaunchPad Workshop - Part 1 Getting Started with the MSP430 LaunchPad Workshop - Part 1
This is the Introduction to the Value Line portion of workshop and Lab 1.

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Getting Started with the MSP430 5xx Experimenters Board - Part 2 Getting Started with the MSP430 5xx Experimenters Board - Part 2
This section covers the 5xx active and low power mode operation.

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Delfino Floating Point Series Overview Delfino Floating Point Series Overview
C2000 has been a well know player in the Industrial and Automotive spaces, and Delfino helps to expand our offerings in higher-end systems. We are now also able to target spaces such as Appliance and Consumer – where there are not only stringent energy and safety standards, but also an abundance of new and innovative end-equipments requiring performance, integration, and a scalable portfolio.

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Concerto™ MCU Technical Overview Concerto™ MCU Technical Overview
Real-time control, connectivity, and software simplicity come together in TI’s Concerto MCU Series. Building on C2000’s industry-leading C28x core and control peripherals, Concerto MCUs add a host subsystem, consisting of the ARM Cortex-M3 core and new communications peripherals such as USB OTG and Ethernet. Combined, Concerto MCUs’ Host and Control subsystems make a cleanly partitioned, single-chip solution to eliminate compromises. Learn more about Concerto MCUs and how you can simplify hardware AND software development in application areas including industrial control, renewable energy, digital power, electric vehicles, and more.

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Code Name: Wolverine The Lowest Power MCU Platform in the World Code Name: Wolverine The Lowest Power MCU Platform in the World
An overview of the new Wolverine line from MSP430.

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C2000™ MCU Isolated AC LED Lighting Kit with Communications C2000™ MCU Isolated AC LED Lighting Kit with Communications
See the newest lighting solution from C2000 microcontrollers, the Isolated AC LED Lighting Kit with Communications. Demonstrating a full line-to-load LED lighting solution, this new developer’s kit jump starts lighting design from efficient power stage design through LED control and advanced communications including PLC.

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Adding Bluetooth to MCU-based Systems Adding Bluetooth to MCU-based Systems
Quickly and easily add Bluetooth (and ANT) technology to systems using MSP430™. In this session, we will provide a quick intro to Bluetooth and ANT technology, detailed overview of the CC2560 Bluetooth device and CC2567 Bluetooth + ANT device, and details of the platform. The platform provides complete system integration of all components including Bluetooth hardware (CC256x module), host hardware (MSP430), firmware, low-level drivers, Bluetooth stack, profiles, RTOS, and sample source applications using APIs.

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C2000 Architecture and Peripherals C2000 Architecture and Peripherals
The C2000 family of microcontrollers contains a unique mix of innovative and cutting-edge peripherals along with a very capable C28x core. This video goes over the core architecture and every peripheral offered on C2000 devices.

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C2000™ Digital Power Solutions: AC/DC and DC/DC C2000™ Digital Power Solutions: AC/DC and DC/DC
This presentation will focus on introducing TI’s latest development solutions for both AC/DC rectifier power supply and DC/DC converters including Power Factor Correction (PFC), Phase-shifted DC/DC, and highly efficient resonant DC/DC etc. An introduction of basic power conversion concepts and topologies such as PFC, DC/DC, interleaved PFC and DC/DC, and resonant DC/DC, will also be presented.

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Concerto MCU Product Training Module Concerto MCU Product Training Module
Real-time control, connectivity, and software simplicity come together in TI’s Concerto MCU Series. Building on C2000’s industry-leading C28x core and control peripherals, Concerto MCUs add a host subsystem, consisting of the ARM Cortex-M3 core and new communications MCUs’ Host and Control subsystems make a cleanly partitioned, single-chip solution to eliminate compromises.

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Getting Started with the MSP430 5xx Experimenters Board - 0 Getting Started with the MSP430 5xx Experimenters Board - 0
Introduction to the workshop.

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Getting Started with the MSP430 5xx Experimenters Board - 1 Getting Started with the MSP430 5xx Experimenters Board - 1
This is Lab 1 of the workshop.

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Solar Development with C2000™ 32-bit Real-time MCUs Solar Development with C2000™ 32-bit Real-time MCUs
Jumpstart solar application designs with two new platforms for both low voltage and high voltage applications from TI, based on C2000 microprocessors.

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Stellaris® ARM-based MCUs: Integrated Communications Stellaris® ARM-based MCUs: Integrated Communications
In this session attendees will receive an overview of Stellaris(R) MCUs and the integrated communications available on chip. Communication interfaces that will be covered include: full speed USB 2.0 On-the-Go (host and device), 10/100 Ethernet MAC and PHY, IEEE 1588 Precision Time Protocol (PTP), CAN networking, and Inter-Integrated Circuit Sound (I2S) Interface. In addition we will discuss the license free and royalty-free StellarisWare software.

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Introduction to Stellaris® ARM Cortex™-M3 MCUs Introduction to Stellaris® ARM Cortex™-M3 MCUs
TI's Stellaris MCUs pair the ARM Cortex-M3 core along with advanced communication capabilities, including 10/100 Ethernet MAC+PHY, CAN, USB On-The-Go, USB Host/Device, SSI/SPI, UARTs, and I2C. This presentation provides an overview of Stellaris MCUs, software tools and kits, StellarisWare™ software, and applications. With more than 140 microcontrollers in TI’s Stellaris family of MCUs, you are sure to find one (or more) that suit your needs!

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MPPT Solar Charger MPPT Solar Charger
Jasraj Dalvi, a Systems Application Engineer from TI India and Salil Chellappan, Lead Engineer for TI's Power Design Services team in TI India disscus an MPPT solar charger reference design.

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Capacitive Touch Demo from TI India Capacitive Touch Demo from TI India
Jasraj Dalvi, a Systems Application Engineer from TI India discusses capactive touch offerings from Texas Instruments. He also shows a capactitive touch demo.

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Multicore Solutions for Test & Automation Markets Multicore Solutions for Test & Automation Markets
This video provides an overview of TI's C66x multicore solutions for industrial automation markets. Customers designing products such as smart cameras, vision controllers and optical inspection systems, will learn about the ultra-high performance, combined fixed-and floating-point performance, and increased number of peripherals and offering per core that TI’s C66x multicore DSPs deliver. TI is also delivering a robust suite of multicore software, tools and support to facilitate development and get customers closer to tapping the performance of C66x multicore DSPs.

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Ask the Expert: Debbie Greenstreet Ask the Expert: Debbie Greenstreet
Why are tools so critical to multicore SoC product development and how is TI addressing such development tool needs? As the business development director for TI’s wireless base station infrastructure business, Debbie is responsible for driving TI’s leading edge wireless base station SoCs into the market, and focusing on business development for North America. Debbie has over 20 years experience in the telecommunications industry. Previous roles at Texas Instruments include the director of service provider strategy where maintained relationships with worldwide wireless and fixed line service providers, driving long term roadmap directions and investment strategies. She was also a pioneer and evangelist in the Voice over IP industry, driving products and solutions into the VoIP market from its infancy. Debbie received a BS in electrical engineering from the University of Virginia and performed graduate work in computer engineering at George Mason University.

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New Sitara(TM) AM335x ARM(R) Industrial development platform Sitara(TM) AM335x ARM(R) Industrial development platform
Learn about how Texas Instruments is making the development for industrial applications on the Sitara(TM) AM335x ARM(R) Cortex(TM)-A8 microprocessor quick and easy. To get to production quickly, customers need complete certified system solutions and development platforms. TI has developed two such tools for use by the industrial market: the Industrial Development Kit and Industrial Communications Engine. In this video, you'll get an overview of how these plaforms, in additon to the AM335x Evaluation Module, are optimized for Industrial designs.

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AM335x ARM(R) MPUs - simplifying industrial designs AM335x ARM(R) MPUs - simplifying industrial designs
Texas Instruments has recently introduced the AM335x ARM Cortex-A8 low power high performance processor family with price points starting at under $5. In this video, you’ll see how these processors help industrial customers enable innovative industrial automation systems. With the AM335x ARM solution, TI delivering a scalable platform with integrated multi-protocol communications support. It’s one family of pin-to-pin and SW compatible devices to address the diverse needs of the entire Industrial Automation system.

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Training: Overview: Electronic Point-of-Sale Solutions Training: Overview: Electronic Point-of-Sale Solutions
The retail automation market is going through some exciting changes with innovation around mobile contactless payments, near field communications and digital couponing technology. TI delivers industry leading technology support for the retail market leveraging its ARM-based microprocessors. TI's solutions support development of a wide range of retail point of sale solutions. With product-ready solutions, customers can easily develop a host of retail applications including: bar code scanners, point of sale devices and portable data terminals. TI's solutions provide fast, secure performance with integrated security features including Secureboot, encryption acceleration and TrustZone Security. In this presentation, you will learn about TI's solutions for the retail automation market, including features, roadmap and product schedule.

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Training: TIs new $5 Sitara AM335x ARM(R) Cortex(TM)-A8 microprocessor Training: TIs new $5 Sitara AM335x ARM(R) Cortex(TM)-A8 microprocessor
TI has recently introduced the AM335x Sitara ARM Cortex-A8 microprocessor. Starting at $5 and consuming as low as 7 mW of power, the AM335x ARM Cortex-A8 microprocessors provide low power consumption, prolonging battery life and reducing heat emissions, to enable portable, pocket-sized, fan-less applications. Offering developers high performance with advanced 3D graphics capabilities, touch screen controller and sophisticated peripherals all on a single chip reduces printed circuit board (PCB) space, complexity and bill of materials (BOM) costs by as much as $40 for smaller sized applications such as portable navigation, handheld gaming and educational devices, home and building automation and more. In this training you will learn about the features and benefits of the AM335x product family, as well as the software and tools that are available to being development.

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AM335x ARM Cortex-A8 Microprocessor AM335x ARM Cortex-A8 Microprocessor
Announcing the AM335x. The latest Sitara Microprocessor featuring ARM Cotex-A8 performance at the cost and power levels of an ARM9.

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Ask the Expert: Ken Nesteroff Ask the Expert: Ken Nesteroff
How does TI's C66x medical imaging software tookit enable developers to better design applications? Ken Nesteroff, high performance computing and imaging business development manager, explains how TI's free, upgraded STK 3.0, powerful C66x DSP core and easy-to-program KeyStone multicore architecture enables developers to more easily design medical imaging products with a significantly shortened development time.

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Ask the Expert: Mukesh Kumar Ask the Expert: Mukesh Kumar
What applications in the test & automation markets would benefit from the performance level of a multicore DSP solution?

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Ask the Expert: Pekka Varis Ask the Expert: Pekka Varis
How does the Keystone Network Coprocessor offload IPSec? Pekka is a visionary technologist with expertise in infrastructure system architectures and high performance packet-based communications. As Chief Technology Officer for TI’s multicore and media infrastructure business, Pekka drives the company’s strategy and development efforts for packet-based multicore processing. Pekka has over 13 years of experience in the communications infrastructure industry. He started off his career implementing platform software and architecting data plane blades for mobile network controllers and multimedia gateways at a leading mobile infrastructure vendor. Over the years he gained extensive experience in system and software architectures for user plane processing in mobile networks. Pekka earned a Master of Science in Electrical Engineering from the Helsinki University of Technology in 1999. He is a Member, Group Technical Staff, at TI.

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Boost existing designs with $5 Sitara AM335x ARM® Cortex™-A8 processor Boost existing designs with $5 Sitara AM335x ARM® Cortex™-A8 processor
CCS: Navigating Source FilesCode Composer Studio provide a number of features for navigating source files that are part of the project. This video shows how to use some of these useful features.

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TPD1E10B09 - TIs First Single-Channel ESD Device TPD1E10B09 - TIs First Single-Channel ESD Device
Roger Liang, a systems engineer at Texas Instruments, discusses VDIODE, the latest brand new process technology from TI. This device has achieved well over 20kV Contact discharge and greater than 20kV Air-gap discharge ratings. This is among the best in the industry. It far exceeds the IEC 61000-4-2 standard specification of 8kV Contact discharge and 15kV Air-gap discharge ratings. The TPD1E10B09 is the first device to use the VDIODE technology.

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Training: Ask the Expert: Henry Wiechman - Code Composer Studio Training: Ask the Expert: Henry Wiechman - Code Composer Studio
How is Code Composer Studio™ integrated development environment (IDE) v5 different from past versions, and how does it benefit developers? Henry Wiechman, software product manager, embedded processing, highlights the new features and support, smaller size and new.

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Training: Ask the Expert: Henry Wiechman - StarterWare Software Suite Training: Ask the Expert: Henry Wiechman - StarterWare Software Suite
What is TI's StarterWare software suite, and how does it make TI's ARM® microprocessors, digital signal processors and DSP + ARM processors easy to develop? Henry Wiechman, software product manager, embedded processing, explains how StarterWare enables developers to quickly and easily optimize software and migrate across a range of TI’s embedded processors without requiring an operating system.

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Training: Ask the Expert: Joe Coombs Training: Ask the Expert: Joe Coombs
How will TI's StarterWare software suite help me develop TI's OMAP-L138 DSP + ARM® processor? Joseph Coombs, applications engineer, TMS320C6000™ DSPs, explains how StarterWare enables developers to optimize software on the OMAP-L138 DSP + ARM processor with peripheral stacks, examples, source code and more.

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Training: Ask the Expert: Loc Truong Training: Ask the Expert: Loc Truong
How does TI’s StarterWare for DSP + ARM® processors enable fast and easy connectivity between the DSP and ARM cores? Loc Truong, technologist and senior member of TI’s TMS320C6000™ DSP technical staff, discussed the lightweight inter-processor communication software on StarterWare for TI’s DSP + ARM processors.

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Training: CCS: Navigating Source Files Training: CCS: Navigating Source Files
CCS: Navigating Source FilesCode Composer Studio provide a number of features for navigating source files that are part of the project. This video shows how to use some of these useful features.

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Training: CCS: Setting a breakpoint on a variable Training: CCS: Setting a breakpoint on a variable
Most TI embedded processors support data breakpoints or watchpoints. These breakpoints are extremely useful for debugging. This video demonstrates how to access this capability.

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Training: CCS: Using the Editor local history feature Training: CCS: Using the Editor local history feature
The source code editor in Code Composer Studio supports a feature called local history. Local history keeps track of revisions made to source files and allows you to compare versions and replace files with a version stored in the local history.

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Training: Getting Started with Code Composer Studio v5 Training: Getting Started with Code Composer Studio v5
This video provides a quick introduction to the Code Composer Studio v5 environment. It walks you through how to get started using the welcome page, resource explorer and project wizard. As well as how to launch debug sessions.

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Training: Linux Application Debug with CCS Training: Linux Application Debug with CCS
Learn how to develop and debug Linux Applications using Code Composer Studio v5 (CCSv5). Many customers of Sitara, Integra and DaVinci spend much of their time developing Linux Applications. In this session you will learn how CCS can be used for both kernel level debug as well as application debug.

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Training: StarterWare from Texas Instruments Training: StarterWare from Texas Instruments
Simplify ARM MPU and DSP development with TI's new OS-optional software suite, StarterWare, offering application programming interfaces (APIs) to configure and interface with peripherals. In addition, StarterWare includes lightweight software stacks to enable USB, network and graphics functionality. Example code and application notes included with StarterWare reduce development time up to 10X.

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Training: TI's C553x DSPs - industry's lowest price and lowest power DSPs Training: TI's C553x DSPs - industry's lowest price and lowest power DSPs
Imagine what you could do with a $2 DSP. You could finally add sophisticated signal processing power to audio and voice applications such as headsets, speakers, smart phone audio accessories and intelligence to your sensor applications at an unprecedented price. The TMS320C553x ultra-low-power DSP generation featuring the lowest power and lowest cost DSP in the industry, starting at $1.95/1 ku, are now available to enable you to do that and much more. Offering the industry’s lowest power with active power less than 0.15 mW/MHz at 1.05V and standby power less than 0.15 mW, these highly integrated processors enable developers to get DSP sophistication at a microcontroller price and power consumption.

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Ask the Expert: Arnon Friedmann Ask the Expert: Arnon Friedmann
How can developers accelerate scientific computing with TI's multicore DSPs? Arnon Friedmann, Ph.D., is the business manager for TI's high performance computing products in the multicore and media infrastructure business. In this video, he explains how TI's multicore DSPs are well suited for computing applications in oil and gas exploration, financial modeling and molecular dynamics, where ultra- high performance, low power and easy programmability are critical requirements.
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AM335x ARM Cortex-A8 Microprocessor AM335x ARM Cortex-A8 Microprocessor
Announcing the AM335x. The latest Sitara Microprocessor featuring ARM Cotex-A8 performance at the cost and power levels of an ARM9.

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Boosting ARM9 Designs with TIs AM335x EVM Boosting ARM9 Designs with TIs AM335x EVM
Boost existing designs with $5 Sitara AM335x ARM® Cortex™-A8 processor.

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Engaging applications for augmented reality Engaging applications for augmented reality
Augmented reality is the perfect application to take advantage of the OMAP(tm) platform’s high quality camera ISP, powerful ARM MPCores, and outstanding graphics capabilities. One example is Metaio's junaio browser, which makes reading a magazine much more interactive as it gives readers the ability to see images differently or view additional content.

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Experiences optimized on the OMAP platform Experiences optimized on the OMAP platform
High quality, high definition video and imaging, rich and sleek UIs, video conferencing, gaming and computing tasks are just a few of the ways OEMs can differentiate their devices and, their end-user experience. In this short series of demos, we’ll show you how OMAP(tm) technology enables you to deliver these things better than anyone else.
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Great graphics capabilities of TI OMAP 5 platform Great graphics capabilities of TI OMAP 5 platform
With gaming, streaming video, advanced user interfaces and stereoscopic 3D becoming more prevalent in smartphones and mobile devices, a mobile applications processor’s graphic abilities have never been more important. TI’s OMAP(tm) 5 processor includes a dedicated 2D graphics core as part of its high-performance, low-power design, in addition to the latest generation 3D graphics core from Imagination Technologies, the POWERVR SGX544.

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It’s about to get greener It’s about to get greener
With innovations in lighting, motor control, and digital power, as well as solar, wind and renewable energy applications, C2000 MCUs have been making the world green for 15+ years – and it’s only getting greener! New C2000™ Concerto™ F28M35x dual-subsystem MCUs combine TI’s C28x core and control peripherals with an ARM® Cortex™-M3 core and connectivity peripherals to deliver a clearly partitioned architecture in a partitioned architecture in a single, cost-efficient device, eliminating the traditional need to choose between optimal performance and advanced connectivity, taking the efficiency to new levels and dramatically saving energy.

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OMAP Rap OMAP Rap
Watch Alejandro Erives, a product marketing manager for TI ARM® microprocessors, give us his artistic take on why designers should use our OMAP technology.

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Simplifying Retail Automation Designs Simplifying Retail Automation Designs
The retail transaction market is going through some major changes with a move towards mobile, contactless payments, and the emergence of near field communications (NFC) and digital coupons. TI is advancing its support for the electronic point-of-sale (EPOS) market with a new reference design based on the AM3715 Cortex™-A8 ARM® microprocessor. The EPOS reference design, provides flexibility to retail customers seeking to differentiate products including: • Countertop payment terminals • Mobile payment terminals with wireless or cellular support • Handheld data terminals with barcode scanning • Full kiosks with barcode scanning, payment and wireless support Learn more today.
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Using Windows® Embedded Compact 7 on TI ARM® Processors Using Windows® Embedded Compact 7 on TI ARM® Processors
Considering using Windows Embedded Compact 7? TI offers a boards support package that makes it easy to develop. Learn more in this overview video.

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Ask the Expert: Artem Aginskiy Ask the Expert: Artem Aginskiy
What applications will benefit from TI’s C553x ultra-low-power DSPs? Artem Aginskiy, market development manager for the emerging end equipments business at Texas Instruments, discusses how sophisticated digital signal processing can be extended to portable applications, including audio and voice, biometric security, portable medical equipment and more — at an ultra-low price.

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Ask the Expert: Jon Beall Ask the Expert: Jon Beall
Why are TI’s C553x ultra-low-power DSPs ideal for audio and voice applications? According to Jon Beall, product marketing manager for the C5000™ ultra-low-power DSPs business at Texas Instruments, there are three main reasons. Find out how ultra-low power consumption, a free software framework for USB audio class and HID applications and integrated digital and analog peripherals in TI’s new C553x ultra-low-power DSPs can take audio and voice applications to the next level.

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Ask the Expert: Marc Kellermann Ask the Expert: Marc Kellermann
Why do TI’s customers choose the C553x ultra-low-power DSPs over competing devices for power consumer audio applications? Marc Kellermann, business development manager for TI’s digital signal processing systems business, answers this customer question, detailing the price, power, performance and software benefits of the C553x ultra-low-power DSPs.
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Ask the Expert: Matt Muse Ask the Expert: Matt Muse
What is the TI C5000™ ultra-low-power DSP strategy for new products? Matt Muse, general manager for the C5000 ultra-low-power DSP business at Texas Instruments, takes on this question, explaining how TI focuses on creating new products that offer ultra-low power consumption, ultra –low price and ease of use through software support — an ideal combination to meet customers’ needs.

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Ask the Expert: Scott Emley Ask the Expert: Scott Emley
How will TI’s C553x ultra-low-power DSPs revolutionize the consumer audio and voice device market? Scott Emley, central marketing manager for the Digital Signal Processing Systems business at Texas Instruments, explains how intelligent signal processing and ultra-low power consumption will meet consumers’ demands for new, improved audio and voice gadgets like voice recorders, headsets and microphones.

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Ask the Expert: Stephan Lau Ask the Expert: Stephan Lau
What software does TI offer for the C553x ultra-low-power DSPs to help customers get to market faster. Stephen Lau, engineering software manager for the C5000™ Ultra-Low-Power DSPs business at Texas Instruments, details the free software TI offers, including the Chip Support Library, application-specific software for audio/voice and telecom applications and Code Composer Studio. He also explains how software compatibility across the C5000™ DSP platform eases product migration for developers.

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TI Breaks the $2 DSP Barrier TI Breaks the $2 DSP Barrier
TI first to break the $2 DSP barrier! Imagine what you could do with a $2 DSP. TMS320C553x ultra-low-power DSPs, the lowest power and lowest cost DSPs in the industry are now available offering the industry’s lowest total active core power at less than 0.15 mW/MHz at 1.05V and standby power at less than 0.15 mW. These highly integrated DSPs enable developers to add sophisticated signal processing power to audio and voice applications such as headset, speakers, smart phone audio accessories and voice recorders – at an unprecedented price starting at $1.95/1ku.
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VCE6467T Overview: DaVinci Digital Media System-on-Chip VCE6467T Overview: DaVinci Digital Media System-on-Chip
TI’s world class DaVinci ™ technology and Radvision’s industry leading BeeHD framework have been brought together in a simple to use, complete video communications solution. Based on TI’s TMS320DM6467T System-on-Chip, the VCE6467 makes it possible to do high-definition 720p H.264 full-duplex video on a single processor. The VCE6467 leverages a 500MHz ARM9 processor with a full 1GHz c64x+ DSP for advanced audio and application processing.

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C6-Integra Platform - Peripheral I/O Overview C6-Integra Platform - Peripheral I/O Overview
Watch this video for a brief overview of the major I/O modules that can be found in the highly-integrated C6-Integra family of DSP+ARM processors

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Embedded System Security with OMAP-L138/C6748 Devices Embedded System Security with OMAP-L138/C6748 Devices
As the list of high-profile security breaches continues to grow and technology pushes into new markets, such as Medical devices, security has become a requirement for many embedded systems. This video enables you to take charge of your security future by understanding the fundamental security questions you need to think about for your system as well as introduce the proven security technologies within the OMAP-L138 C6-Integra™ DSP+ARM processors and C6748 High Performance DSPs

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Fueling Innovation in Next Generation of Machine Vision Apps Fueling Innovation in Next Generation of Machine Vision Apps
Machine Vision is a branch of Computer Vision which is used in industries for analysis of objects by capturing of images and performing real time analysis. Major Machine Vision applications lie in the semiconductor industry and quality control of consumer products industry. Vision system Controllers, Smart cameras and Frame Grabbers which captures the live images in helps in identifying the defective semiconductors and products. Machine vision applications poses requirements on highly integrated system solutions which can provide compact, low cost, low power and fast solutions. This video provides how TI devices can help in providing ideal Machine Vision solutions.
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OMAP-L138 Interconnect Tuning OMAP-L138 Interconnect Tuning
The C674x DSPs and OMAPL13x C6-Integra DSP+ARM devices include several high bandwidth IO peripherals and many master cores. This wide variety of cores and peripherals represent multiple real-time datastreams that must be carefully balanced in order to achieve the full performance available in the SoC. The system interconnect in these devices enables tuning of the key system parameters to meet the real time bandwidth constraints and maximize overall external memory bandwidth. This video will give an overview of the key components and describe techniques to optimize the system performance.

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Power Saving Options on OMAP-L1x Devices Power Saving Options on OMAP-L1x Devices
The C6-Integra OMAP-L1x line of processors offers a variety of hardware features to reduce power consumption. This short video describes how to take advantage of them to reduce both system cost and development time.

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VCE6467T Overview: DaVinci Digital Media System-on-Chip VCE6467T Overview: DaVinci Digital Media System-on-Chip
TI’s world class DaVinci ™ technology and Radvision’s industry leading BeeHD framework have been brought together in a simple to use, complete video communications solution. Based on TI’s TMS320DM6467T System-on-Chip, the VCE6467 makes it possible to do high-definition 720p H.264 full-duplex video on a single processor. The VCE6467 leverages a 500MHz ARM9 processor with a full 1GHz c64x+ DSP for advanced audio and application processing.

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AM35x Online Workshop AM35x Online Workshop
This AM35x on-line workshop describes the content of the AM3517 contained in the sixteen modules (separate).

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How to Install the AM37x Software Development Kit (SDK) How to Install the AM37x Software Development Kit (SDK)
Step-by-step instructions on how to install the AM37x Linux SDK to get up and running with development on the AM3715 or AM3703.

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Intro to Power Estimation Tool for AM35x Sitara and OMAP35x Intro to Power Estimation Tool for AM35x Sitara and OMAP35x
The Power Estimation Tool for AM35x Sitara ARM microprocessors and OMAP35x microprocessors provides users the ability to gain insight into the power consumption of these devices.The tool includes the ability to choose multiple application scenarios to compare power numbers and show how applying advanced power saving techniques can further reduce overall power consumption. To access the Power Estimation Tool click on the link below. Creative Category: ASP_DSP_Sitara ARM MPU.
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Ask the Expert: How has TI optimized its KeyStone architecture for small cell developers with its latest SoC? Ask the Expert: How has TI optimized its KeyStone architecture for small cell developers with its latest SoC?
How has TI optimized its KeyStone architecture for small cell developers with its latest SoC? Kyle is the marketing director for TI's wireless base station infrastructure business, and is a wireless and high performance microprocessor industry veteran. Prior to joining TI, he developed and managed wireless and networked devices business for Motorola Semiconductor and Applied Micro. He received his BS in Computing Science from Texas A&M, and his MBA from the University of Texas at Austin.

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C6000 7.x Code Generation Tool Enhancements C6000 7.x Code Generation Tool Enhancements
TI continues to invest heavily in code generation tools for C6000 DSP core. C6000 DSP core is part of C6000 DSP only and DSP+ARM C6-Integra processors. This video describes the enhancements that have been made in the 7.2 compiler as compared to the previous generation 6.x compiler.

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C6-Integra Signal Analyzer Demonstration C6-Integra Signal Analyzer Demonstration
Signal Analyzer Demonstration using C6-Integra(TM) DSP+ARM(R) product platform

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Designing Scalable Products for the Small Cell Market Designing Scalable Products for the Small Cell Market
This video provides an introduction to the TMS320TCI6612 and TMS320TCI6614, TI’s comprehensive SoCs for developers of metro, pico and enterprise small cell base stations. Based on TI’s innovative KeyStone multicore architecture, these scalable SoCs encompass a mix of processing elements including radio accelerators, network and security coprocessors, combined fixed-and floating-point DSPs and an ARM® RISC processor, providing the ideal foundation for layers 1, 2 and 3 and transport processing for high performance small cell base stations.

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Introduction to DaVinci™ DM37x Android HD Video Solution Introduction to DaVinci™ DM37x Android HD Video Solution
Learn about TI's very popular Android multimedia solution supporting 720p30 HD video on our DM3730 Evaluation Board.

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Ask the Expert: How does TI’s new multicore software development kit enable rapid development and faster time to market with TI’s multicore DSPs? Ask the Expert: How does TI’s new multicore software development kit enable rapid development and faster time to market with TI’s multicore DSPs?
How does TI's new Multicore Software Development Kit enable rapid development and faster time to market with TI's multicore DSPs? As the strategic manager for TI's multicore and media infrastructure business, Sanjay is responsible for the definition of multicore software solutions. Sanjay holds a MS in Electrical Engineering from the University of Mumbai and a MBA from the University of Maryland.

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Ask the Expert: How has TI collaborated with the community to offer Linux support on its new multicore software development kit? Ask the Expert: How has TI collaborated with the community to offer Linux support on its new multicore software development kit?
How has TI collaborated with the community to offer Linux support on its new Multicore Software Development Kit? Raghu currently works as a project lead for enabling Linux support on TI’s C6000 family of multicore DSPs. He has been involved in multiple software development projects within TI's communications infrastructure group, and recently served as project lead for the design and development of TI’s multicore voice and video software development kit. Raghu holds a MS in telecommunications from the University of Colorado and is currently pursuing his MBA from the University of Maryland.

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Ask the Expert: What is the BIOS Multicore Software Development Kit and how does it help customers get to market faster? Ask the Expert: What is the BIOS Multicore Software Development Kit and how does it help customers get to market faster?
What is the BIOS Multicore Software Development Kit and how does it help customers get to market faster? Raj has nearly 15 years of experience in real-time embedded software development. For the past 11 years at Texas Instruments, Raj has been responsible for providing roduction application software for Voice over IP on cable modem/DSL/residential gateway, and multimedia software development kits for digital video and voice, enabling customers to build their applications on a core software foundation while speeding time to market. Raj received his MS in electrical engineering, BS in electrical engineering and BS in mathematics from the University of Maryland.

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Ask the Expert: What is TI’s KeyStone multicore architecture and how is it used for wireless base stations? Ask the Expert: What is TI’s KeyStone multicore architecture and how is it used for wireless base stations?
What is TI's KeyStone multicore architecture and how is it used for wireless base stations? As the director of technical strategy for TI’s wireless base station infrastructure business, Tom identifies market trends and provides the vision and strategic direction for TI’s product development team. Tom joined TI as part of the company’s acquisition of Telogy Networks, a Voice over IP embedded software company, where he was the director of business development. He has an extensive background in the semiconductor industry and in voice and data networking. Tom holds several patents and received his bachelor’s degree of science from James Madison University.

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Brian Carlson: OMAP™ 5 platform introduction Brian Carlson: OMAP™ 5 platform introduction
TI’s OMAP 5 mobile applications platform is positioned to transform how mobile devices such as Smartphones, tablets and other mobile form factors are used, making them even more useful in our daily lives.

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Brian Carlson: OMAP™ 5 SoC overview Brian Carlson: OMAP™ 5 SoC overview
This video provides a virtual tour of the OMAP 5 System-on-Chip (SoC)

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Demonstration of WLAN and Bluetooth on the OMAP35x EVM Demonstration of WLAN and Bluetooth on the OMAP35x EVM
A demonstration of the OMAP35x evaluation module (EVM): the first platform to include TI's wireless connectivity technology. See what's possible with the WL1271 module based daughter card attached.

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OMAP™ 5 platform: Transforming mobile devices OMAP™ 5 platform: Transforming mobile devices
This video showcases some of the enhanced consumer experiences enabled by TI’s OMAP™ 5 platform technology.

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Getting started with WLAN and Bluetooth on the OMAP35x EVM Getting started with WLAN and Bluetooth on the OMAP35x EVM
Getting started with the OMAP35x evaluation module (EVM): the first platform to include TI's wireless connectivity technology. Learn how to bring up the EVM, download Wireless LAN (WiLAN) and Blueooth® images, and connect to a WiLAN network.

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Ask the Expert: How has your wireless base station SoC strategy changed over the last ten years? Ask the Expert: How has your wireless base station SoC strategy changed over the last ten years?
In TI’s Ask the Experts video series, get answers to your most common technical questions about TI’s DSP and multicore products, including our newest C66x DSP core, KeyStone architecture and C66x devices. In this video, you’ll hear Paul Carson, IP design director for TI’s communications infrastructure business, answer the question, 'How has your wireless base station SoC strategy changed over the last ten years?'

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Ask the Expert: How have TI tools helped to accelerate customer development the TCI6616? Ask the Expert: How have TI tools helped to accelerate customer development the TCI6616?
TI’s Ask the Experts video series, get answers to your most common technical questions about TI’s DSP and multicore products, including our newest C66x DSP core, KeyStone architecture and C66x devices. In this video, you’ll hear Greg Wood, applications manager for TI’s wireless base station infrastructure business, answer the question, 'How have TI tools helped to accelerate customer development the TCI6616?'

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Ask the Expert: How is TI helping base station vendors reduce service provider electrical power costs, achieving more 'green' operations? Ask the Expert: How is TI helping base station vendors reduce service provider electrical power costs, achieving more 'green' operations?
In TI’s Ask the Experts video series, get answers to your most common technical questions about TI’s DSP and multicore products, including our newest C66x DSP core, KeyStone architecture and C66x devices. In this video, you’ll hear Sanjive Aggarwala, director of silicon development for TI’s communications infrastructure business, answer the question, 'How is TI helping base station vendors reduce service provider electrical power costs, achieving more 'green' operations?'

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Ask the Expert: How is TI helping speed development time for customers with new multicore devices? Ask the Expert: How is TI helping speed development time for customers with new multicore devices?
In TI’s Ask the Experts video series, get answers to your most common technical questions about TI’s DSP and multicore products, including our newest C66x DSP core, KeyStone architecture and C66x devices. In this video, you’ll hear Travis Scheckel, platform software applications manager for TI’s multicore and media infrastructure business, answer the question, 'How is TI helping speed development time for customers with new multicore devices?'

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Ask the Expert: How is TI uniquely positioned to enable OEMs to build a multistandard base station? Ask the Expert: How is TI uniquely positioned to enable OEMs to build a multistandard base station?
In TI’s Ask the Experts video series, get answers to your most common technical questions about TI DSP and multicore product, including the TMS320C66x DSP core, KeyStone architecture and C66x devices. In this video, you’ll hear Debbie Greenstreet, marketing director for TI’s Wireless Base Station Infrastructure business, answer the question, 'How is TI uniquely positioned to enable OEMs to build a multistandard base station?'

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Ask the Expert: The new C66x DSP benchmarks reflect up to a 5x improvement in performance over other cores. How is this achieved? Ask the Expert: The new C66x DSP benchmarks reflect up to a 5x improvement in performance over other cores. How is this achieved?
In TI’s Ask the Experts video series, get answers to your most common technical questions about TI’s DSP and multicore products, including our newest C66x DSP core, KeyStone architecture and C66x devices. In this video, you’ll hear Mingjian 'Ming' Yan, software development engineer for TI’s communications infrastructure business, answer the question, 'The new C66x DSP benchmarks reflect up to a 5x improvement in performance over other cores. How is this achieved?'

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Ask the Expert: TI’s single chip small cell SoC has reduced the analog componentry at the board level; how is this achieved? Ask the Expert: TI’s single chip small cell SoC has reduced the analog componentry at the board level; how is this achieved?
In TI’s Ask the Experts video series, get answers to your most common technical questions about TI’s DSP and multicore products, including our newest C66x DSP core, KeyStone architecture and C66x devices. In this video, you’ll hear Sameer Wasson, product marketing manager for TI’s wireless base station infrastructure business, answer the question, 'TI’s single chip small cell SoC has reduced the analog componentry at the board level; how is this achieved?'

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Ask the Expert: What has TI done to enhance its multicore architecture and how does this benefit the customer? Ask the Expert: What has TI done to enhance its multicore architecture and how does this benefit the customer?
In TI’s Ask the Experts video series, get answers to your most common technical questions about TI’s DSP and multicore products, including our newest C66x DSP core, KeyStone architecture and C66x devices. In this video, you’ll hear Sandeep Kumar, growth markets and medical product line marketing manager for TI’s multicore and media infrastructure business, answer the question, 'What has TI done to enhance its multicore architecture and how does this benefit the customer?'

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Ask the Expert: What is TI's strategy for determining which acceleration functions are allocated in hardware in its newest base station SoC? Ask the Expert: What is TI's strategy for determining which acceleration functions are allocated in hardware in its newest base station SoC?
In TI’s Ask the Experts video series, get answers to your most common technical questions about TI DSP and multicore products, including the TMS320C66x DSP core, KeyStone architecture and C66x devices. In this video, you’ll hear Zhihong Lin, strategic marketing manager for TI’s Wireless Base Station Infrastructure business, answer the question, 'What is TI’s strategy for determining which acceleration functions are allocated in hardware in its newest base station SoC?'

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Ask the Expert: Why is floating-point capability beneficial for base station implementations? Ask the Expert: Why is floating-point capability beneficial for base station implementations?
In TI’s Ask the Experts video series, get answers to your most common technical questions about TI’s DSP and multicore products, including our newest C66x DSP core, KeyStone architecture and C66x devices. In this video, you’ll hear Dr. Arnon Friedmann, strategic and technical marketing manager for TI’s wireless base station infrastructure business, answer the question, 'Why is floating point capability beneficial for base station implementations?'

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Brian Carlson: OMAP™ 5 platform introduction Brian Carlson: OMAP™ 5 platform introduction
TI’s OMAP 5 mobile applications platform is positioned to transform how mobile devices such as Smartphones, tablets and other mobile form factors are used, making them even more useful in our daily lives.

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Brian Carlson: OMAP™ 5 SoC overview Brian Carlson: OMAP™ 5 SoC overview
This video provides a virtual tour of the OMAP 5 System-on-Chip (SoC)

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OMAP™ 5 platform: Transforming mobile devices OMAP™ 5 platform: Transforming mobile devices
This video showcases some of the enhanced consumer experiences enabled by TI’s OMAP™ 5 platform technology.

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Developing HD Video Applications with the TI DaVinci DM8168 Developing HD Video Applications with the TI DaVinci DM8168
Start developing compelling HD video applications with TI’s new DM8168 high performance processor within the DaVinci platform. The DM8168 consolidates all of the video capture, compression, display, and applications processing required for a high definition multi-channel system onto a single chip.

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AM1810 Sitara™ ARM®  MPU PROFIBUS Demo AM1810 Sitara™ ARM® MPU PROFIBUS Demo
Get introduced to AM1810 and integration of PROFIBUS interface on this device. Also learn how to get started and find more information on using AM1810 in industrial systems.

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Sitara™ ARM Microprocessor Overview Sitara™ ARM Microprocessor Overview
In this video, you will gain insight into TI’s Sitara™ family of high performance, ARM-based microprocessors (MPUs). The Sitara family further shows TI’s commitment to continued investment and innovation in the ARM architecture.

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The Future of DSP with Gene Frantz, Question 3 The Future of DSP with Gene Frantz, Question 3
What is TI doing to help DSP reach these goals?

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The Future of DSP with Gene Frantz, Question 4 The Future of DSP with Gene Frantz, Question 4
How is the TI positioning themselves to remain the leader in DSP?

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The Future of DSP with Gene Frantz, Question 5 The Future of DSP with Gene Frantz, Question 5
How will DSP impact artificial vision?

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The Future of DSP with Gene Frantz, Question 6 The Future of DSP with Gene Frantz, Question 6
Will DSP significantly impact quality of life?

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The Future of DSP with Gene Frantz, Question 7 The Future of DSP with Gene Frantz, Question 7
Are there other areas that DSP will impact?

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A Perfect 10 – Industry’s first 10-GHz fixed/floating point DSP: New C66x Multicore DSPs A Perfect 10 – Industry’s first 10-GHz fixed/floating point DSP: New C66x Multicore DSPs
TI has once again raised the power and performance bar by offering a multicore device with 10 GHz of cumulative performance in its new generation of TMS320CC66x DSPs. The C66x devices are built with multiple 1.25 GHz DSP cores and deliver combined fixed and floating point performance on a single device. Translating to 320 GMACs and 160 GFLOPs per chip, and with versions running under 10 Watts, this provides performance and power efficiency unparalleled in today’s market. With multiple device options, infrastructure system developers can now more easily design integrated, software upgradeable, power and cost-efficient platforms in markets such as mission critical, including public safety and defense, medical and high-end imaging, test and automation, high-performance computing and core networking.

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DSP core and memory architecture improvements: KeyStone multicore architecture for C66x DSPs DSP core and memory architecture improvements: KeyStone multicore architecture for C66x DSPs
In a multicore SoC environment, memory efficiency is crucial for the system performance. TI’s KeyStone architecture offers a highly memory efficient architecture, which is critical for multicore system performance with improvements to the cache, shared memory, and external memory interface architectures. KeyStone includes TI’s newest TMS320CC66x DSP core, which supports both fixed-point and floating-point operations. It doubles the data paths within the CPU functional units and cross-paths. It also quadruples the available SIMD data widths for operations from the register files to allow 128-bit (quad-32-bit) values. With upgraded instruction sets, the C66x DSP core is optimized for complex arithmetic and linear algebra and provides 4 times MAC capability over existing solutions. At the same time, it provides full binary compatibility with TI’s C64x+ and C674x+ DSPs.

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Industry’s first wireless base station SoC with 4G class performance: TCI6616 SoC and KeyStone architecture Industry’s first wireless base station SoC with 4G class performance: TCI6616 SoC and KeyStone architecture
Operators are challenged to cost effectively keep ahead of the data deluge without compromising quality of service. 4G is needed because its packet-based nature gives operators a technological advantage in delivering data. TI addresses the challenges of 4G with its new TMS320TCI6616 System on Chip. This SoC combines unmatched DSP multicore performance with dedicated hardware coprocessors, all based on TI’s KeyStone multicore architecture specifically designed for efficient data movement. The TCI6616 is based on TI’s new TMS320C66x DSPs and delivers more than double the performance of any 3G/4G SoC in the market. The TCI6616 also boasts the industry’s first multicore DSP that processes both fixed and floating point math, an innovative capability that simplifies wireless base station software design.

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Unleashing full multicore entitlement: KeyStone multicore architecture for C66x DSPs Unleashing full multicore entitlement: KeyStone multicore architecture for C66x DSPs
TI’s new KeyStone multicore architecture is truly a game changer, providing the highest MIPS with the lowest power for multicore DSPs in the industry. KeyStone is based on TI’s new TMS320C66x multicore DSPs that integrate fixed and floating point capabilities in the industry’s highest performing CPU. The new architecture provides the flexibility to include targeted coprocessing, fixed- and floating-point operations, optimized inter-element communications, and a variety of processor types. KeyStone incorporates DSP cores capable of both 32 GMACs per core for fixed-point operations and 16 GFLOPS for floating-point operations. This represents a performance boost that far exceeds the expectation of Moore’s Law in a single generation and also brings to market the first floating-point processor capable of operating at the highest DSP performance levels.

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AM389x Sitara ARM MPUs AM389x Sitara ARM MPUs
AM3892 and AM3894, two new Sitara™ ARM® Cortex™-A8 microprocessors delivering up to 1.5 GHz ARM Cortex-A8 performance with high system integration for faster, more robust applications. These MPUs are suitable for a wide variety of applications, such as communications, networking, single-board SoC computing, industrial and point-of-service applications. With extreme system and peripheral integration, the Sitara AM3892 and AM3894 ARM MPUs provide multiple high-performance interfaces, such as PCIExpress Gen2, dual USB 2.0, SATA 2.0, dual Gigabit Ethernet and DDR2/DD3 controllers.

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AM37x EVM Demonstration AM37x EVM Demonstration
See the AM37x Sitara 1GHz processor in action, exploring some of the key features of the AM37x EVM including its new graphical user interface and 3D graphics demonstration.

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C6A8168 C6-Integra™ Processor Overview C6A8168 C6-Integra™ Processor Overview
The C6A8168 is the industry’s highest-speed DSP plus ARM processor with a 1.5 GHz floating. It also has fixed point 674x DSP and a 1.5 GHz ARM Cortex-A8. The integrated DSP plus ARM architecture lowers system cost by reducing board space and allowing unified external memory. The C6A8168 processor is highly integrated with a large set of network connectivity and peripheral options. The device sustains high-throughput and low latency to external memory with 256 Kilobyte L2 caches and two 32-bit DDR3 interfaces. The processor supports three high-quality displays at up to 1920 by 1280 resolution. Integrated 3D graphics and video enhancement processing deliver a superior user experience. Other peripherals include 2-lane PCIe, 2 USB ports, 2 SATA interfaces, 2 Gigabit Ethernet MACs, and 2 video capture ports. The processor delivers unprecedented performance for applications requiring high-precision signal processing Examples include avionics, medical equipment such as ultrasound systems, test and measurement with RF signal analysis and visual inspection.

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Introduction to DaVinci™ DM37x SoC Introduction to DaVinci™ DM37x SoC
This video provides an introduction to the DaVinciTM DM37x product line which integrates a 1 GHZ ARM Cortex-A8 + an 800 MHZ DSP into a single cost-effective, low power, and high-performance digital media processor; you will learn about the key device characteristics, target applications and developments tools to quickly get started evaluating and developing in this platform.

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AM1808 Development Kit Demonstration AM1808 Development Kit Demonstration
Addressing tSee a demonstration of the Sitara AM1808 EVM, highlighting the strength of the graphics capabilities of the processor via user interface and menus.

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Important Considerations for Selecting a Multicore SoC Important Considerations for Selecting a Multicore SoC
TI's Mark Nadeski debunks the myths surrounding multicore processing, emphasizing the importance of focusing on overall performance that a SoC can deliver for your application. Using a car analogy, Nadeski explains that equipment manufacturers must dig deeper when considering multicore, and look beyond the number of cores on chip to achieve objectives.

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Ultrasound Scan Conversion Demo on OMAP3530 Ultrasound Scan Conversion Demo on OMAP3530
TI's Mark Nadeski demonstrates the ultrasound scan conversion algorithm, one of several optimized modules in TI's embedded processor software toolkit for medical diagnostic ultrasound manufacturers.

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TMS320C6472 Multicore Processor TMS320C6472 Multicore Processor
TI's Sandeep Kumar and Loc Truong discuss the lightning performance, low power, and low cost of the six-core TMS320C6472 and its affordable EVM for performance-hungry industrial and embedded applications.

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C5514/15 DSPs extend the industry's lowest power 16-bit DSP platform C5514/15 DSPs extend the industry's lowest power 16-bit DSP platform
Learn the details of the newest DSP that extend the industry's lowest power 16-bit DSP platform.

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1 GHz TMS320DM6467T DaVinci Video Processor and Evaluation Module GHz TMS320DM6467T DaVinci Video Processor and Evaluation Module
Review the features of the new DM6467T 1 GHz DSP. This single chip solution is ideal for applications such as video conferencing systems, digital signage and media gateways.

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Evaluating ARM Cortex-M4F Microcontrollers Evaluating ARM Cortex-M4F Microcontrollers
The Stellaris LM4F232 USB+CAN Evaluation Kit is a compact and versatile evaluation platform for the Stellaris LM4F232 ARM® Cortex™-M4F-based microcontroller. The evaluation kit design highlights the LM4F232 microcontroller’s integrated USB 2.0 On-the-Go/Host/Device interface, CAN, analog, and low-power capabilities.

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Stellaris ARM Cortex-M4F Microcontrollers w/ floating point Stellaris ARM Cortex-M4F Microcontrollers w/ floating point
Continuing to empower developers with leading ARM®-based embedded processing solutions, TI now has a new low power, floating-point Stellaris® Cortex™-M4F microcontroller generation. All of the new LM4Fx Stellaris microcontrollers provide floating point for performance headroom and best-in-class power consumption to address portability and power budgets. Developers can also select from a variety of high-performance analog, memory and connectivity options to best satisfy design parameters across a broad range of applications, such as industrial automation, motion control, health and fitness and more. The new Stellaris MCUs are the first Cortex-M-based microcontrollers to be built on 65 nanometer (nm) technology, paving the roadmap to higher speeds, larger memory and even lower power.

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What is real-time control? What is real-time control?
Keith Ogboenyiya, C2000™ MCU general manager, explains what it really means to do real-time control and how it is the foundation for the C2000™ MCU platform.

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Getting Started with HALoGen Getting Started with HALoGen
This video provides a brief overview of how to use HALCoGen in conjunction with CCSv4 in order to configure and generate peripheral code.

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Hercules™ Safety MCU RM48 USB Stick Kit Overview Hercules™ Safety MCU RM48 USB Stick Kit Overview
There are several low cost development kits available for the HerculesTM platform of Safety Microcontrollers. This video features an in-depth look at the RM48x Hercules USB Stick Development Kit and the demonstration software that is included with the kit.

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TMS570 Microcontroller Development Stik Overview TMS570 Microcontroller Development Stik Overview
This video highlights the features of the TMS570 USB Microcontroller Development Stick and the included demo software.

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Hercules Safety MCU Development Kits Hercules Safety MCU Development Kits
Hercules Safety MCU Development KitsThere are several low cost development kits available for the HerculesTM platform of ARM® Safety Microcontrollers. This video gives an overview of the RM4, TMS570 and TMS470M MCU development kits available. The video also features an in-depth look at the new RM48x Hercules Development Kit (HDK) and the demonstration software that is included with the kit.

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Overview of the Hercules Platform of Safety MCUs Overview of the Hercules Platform of Safety MCUs
The HerculesTM platform of Safety Microcontrollers consists of three ARM® Cortex™-based microcontroller families that deliver scalable performance, connectivity, memory and safety features for applications that require a high level of reliability. This video gives an overview of the Hercules RM4, TMS570 and TMS470M MCU families and the development tools that are available.

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TMS470M Transportation and Safety Microcontroller Overview TMS470M Transportation and Safety Microcontroller Overview
The ARM® CortexTM-M3 Based TMS470M Microcontroller family enables value minded developers to easily create safety related applications for the transportation industry. This video gives an overview of the TMS470M MCU family and the development tools that are available.

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TMS570 Microcontroller Family Overview TMS570 Microcontroller Family Overview
Running in asynchronous mode, the TMS570 device was the first to achieve IEC 61508 compliance, the highest level of safety and reliability for automotive applications. The TMS570 is the first homogeneous Cortex ARM R4 based MCU target safety critical automotive applications with a patent-pending implementation of the lock-step cores.

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AFE031 - Integrated Analog Front End for Power Line Comm AFE031 - Integrated Analog Front End for Power Line Comm
Enabling the Smart Grid, Power Line Communications is a cost effective way to implement low data rate communications in common applications such as electricity meters, electric vehicle supply equipment, lighting systems, solar energy systems and home automation

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Home Area Networking with Wireless 6LoWPAN Solutions Home Area Networking with Wireless 6LoWPAN Solutions
Discover the benefits of the TI system technology and new 6LoWPAN capabilities for wireless home area networking in this hands-on demo.

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MSP430 Energy Watch Dog Smart Plug Reference Design MSP430 Energy Watch Dog Smart Plug Reference Design
The Energy Watchdog tool can be used to accurately measure power consumption of any household electrical appliance. The power measurement is performed using the MSP430AFE253 energy metering IC and results are displayed on a LCD screen.

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Smart Meter Reference Design Smart Meter Reference Design
TI's Smart Meter Reference Design combines the best of ultra-low-power control, power line communications and ZigBee RF communication.

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Smart Power and Energy Evaluation Board Demonstration Smart Power and Energy Evaluation Board Demonstration
Discover TI's new smart grid infrastructure development tool, signal processing; Full Linux® BSP supported by TI; High-performance AIC provides 16-bit sampling at low SNR Supports control and data communications: Ethernet, PLC, <1-GHz RF, RS232, CAN; Designed with best practices for high-speed systems: Good reference design for featuring: Three-phase power system: Three current and voltage inputs plus neutral; Isolation to prevent damage from high voltages and currents; OMAP™-L138 processor: Integra™ DSP + ARM® for control, communications and passing ESD system tests

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ZigBee IP and Smart Energy Profile 2.0 for the Smart Home ZigBee IP and Smart Energy Profile 2.0 for the Smart Home
Demonstrating ZigBee IP and Smart Energy Profile 2.0 for home automation and smart grid solutions.

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ZigBee Smart Energy Home Area Network Demo ZigBee Smart Energy Home Area Network Demo
Add a home automation profile to this integrated personal energy management solution, and see our latest smart grid system demonstration.

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Brushless DC Motor Animation Brushless DC Motor Animation
This animation shows the correct sequence for commutating a three phase brushless DC motor containing four rotor poles and six stator poles. Three hall-effect sensors are included with 120 degree spatial separation. The hall sensor output waveforms are shown, which drive the commutation process. The three phase voltage waveforms are also shown, including the effects of inductive flyback. The voltage waveforms are synchronized to an inverter diagram showing which transistors are driven for each commutation state.

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Concerto™ MCUs: Connectivity without compromise Concerto™ MCUs: Connectivity without compromise
Concerto™ F28M35x Microcontrollers combine the C28x core and control peripherals with an ARM® Cortex™-M3 core and communication peripherals. The result is a dual subsystem microcontroller with a clearly partitioned and optimized architecture supporting real-time control and advanced connectivity in a single, cost efficient MCU.

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Introducing the FRAM Experimenter Board Introducing the FRAM Experimenter Board
This brief video demonstrates the new FRAM experimenter board, showcasing the clear advantages of using FRAM over conventional Flash memory.

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Stellaris® ARM® Cortex™ M3 MCUs: Ethernet, USB, CAN Stellaris® ARM® Cortex™ M3 MCUs: Ethernet, USB, CAN
Out of the Box: Stellaris 32-bit ARM Cortex-M3 microcontroller, the LM3S9B96, is highlighted in this development board demonstration for applications using Ethernet, USB and CAN. This video demonstrates the the development kit (DK-LM3S9B96) and its FPGA and EM2 expansion boards. Also includes a graphics demo of StellarisWare(R) Graphics Library, simultaneous audio streaming and visual display showcasing communications capability, FPGA demo in a security application.

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controlSUITE: All C2000 resources at your fingertips controlSUITE: All C2000 resources at your fingertips
Easily find and stay up to date with all C2000 resources, including device software and examples, application and math libraries, kit software, kit hardware designs, documentation, training, and more.

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TI @ APEC2011: Digital Power Conversion with C2000™ MCUs TI @ APEC2011: Digital Power Conversion with C2000™ MCUs
Digital power development boards, featuring a MPPT (maximum power point tracking) boost DC/DC + Isolated LLC board based on C2000™ Piccolo™ MCUs. Coupled with a Grid-Tied DC/AC converter, also based on Piccolo MCUs. Benefits include maximum efficiency across full load range; reduced component count (integrated hardware - up to 4.6-MSPS ADCs, 150-ps resolution PWMs, comparators and DACs) with power line modem; scalable, programmable MCU platform. Also features an easy-to-use module controlSUITE™ with supporting software libraries, training and documentation.

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C2000™ Piccolo™ MCU Multi-DC/DC Color LED Kit C2000™ Piccolo™ MCU Multi-DC/DC Color LED Kit
Introducing the new C2000 Multi-DC/DC Color LED Developer’s Kit, based on TI’s Piccolo MCU. The kit features digital control of a multi-string LED design implementation driven by multiple, independent DC/DC power stages. This video provides a brief introduction to the kit as well as a demonstration showcasing color mixing.

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Power Line Communications Solutions Power Line Communications Solutions
Hardware and software solutions for PLC and metering infrastructure.

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C2000 VCU, Viterbi, Complex Math, and CRC C2000 VCU, Viterbi, Complex Math, and CRC
Boosting the performance of C2000(TM) MCUs This video explains the exciting new feature called the VCU, or Viterbi, Complex Math and CRC unit. VCU adds exciting CPU processing capabilities to the new C2000™ Piccolo™ F2806x series of microcontrollers. As the name implies, VCU adds a complex math arithmetic unit, a Viterbi unit, and a Cyclic redundancy check (CRC) unit.

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DRV8412-C2-KIT, Brushed DC and Stepper Motor Control Kit DRV8412-C2-KIT, Brushed DC and Stepper Motor Control Kit
Overview of how to get started with TI's Brushed DC and Stepper Motor Control Kit, featuring the Piccolo F28035 controlCARD and the DRV8412 Integrated Motor Driver

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Low-cost Real-time Floating Point MCU: Piccolo™ F2806x MCU Low-cost Real-time Floating Point MCU: Piccolo™ F2806x MCU
The new C2000™ Piccolo F2806x MCUs bring developers more integration as well as the precision and programming benefits of floating-point at a low cost. By bridging the low-cost Piccolo and floating-point Delfino line developers have the price, performance and peripheral options they need to drive development of energy-efficient real-time control applications.

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C2000 Real-Time Features C2000 Real-Time Features
C2000 has two very useful features called real-time mode and real-time interrupts. They can be of great use when debugging software. Learn more about real-time mode and real-time interrupts and watch a demo of how to operate them in Code Composer IDE with an example from controlSUITE.

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ControlSUITE Desktop ControlSUITE Desktop
controlSUITE Desktop is a powerful utility that brings all C2000 software and resources into one easy-to-use interface. controlSUITE Desktop ensures access to the latest versions of kit and device software, datasheets, user guides, application notes, and more from your computer.

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Crosshairs Embedded Crosshairs Embedded
Crosshairs Embedded creates innovative software aimed to make microcontroller and DSP systems more efficient and easier to manage. Learn about Crosshairs Embedded's latest products, including the powerful Functional Debugger and the Interface Designer for advanced monitoring.

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Stellaris 2.4-GHz SimpliciTI™ Wireless Kit (DK-EM2-2500S) Stellaris 2.4-GHz SimpliciTI™ Wireless Kit (DK-EM2-2500S)
Merging the performance and ease-of-use of Stellaris® ARM® Cortex™-M3-based microcontrollers (MCU) with leading wireless connectivity solutions, TI extends its portfolio with the new Stellaris 2.4 GHz SimpliciTI™ Wireless Kit (DK-EM2-2500S). The kit serves as a modular extension to TI’s Stellaris DK-LM3S9B96 development kit to give engineers complete software and reference design solutions for adding low power RF capabilities to designs. With this offering, TI is building on its broad portfolio of 16-bit, ultra-low-power MSP430™-based wireless connectivity solutions, now providing 32-bit Stellaris MCU performance for execution of additional advanced connectivity and control functions.

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Stellaris for Wireless Connectivity Solutions Stellaris for Wireless Connectivity Solutions
Merging the performance and ease-of-use of Stellaris® ARM® Cortex™-M3-based microcontrollers (MCU) with leading wireless connectivity solutions, TI adds three new wireless kits. The kits serve as modular extensions to TI’s Stellaris DK-LM3S9B96 development kit to give engineers complete software and reference design solutions for adding RFID, low-power RF and ZigBee capabilities to designs. With this offering, TI is building on its broad portfolio of 16-bit, ultra-low-power MSP430™-based wireless connectivity solutions, now providing 32-bit Stellaris MCU performance for execution of additional advanced connectivity and control functions.

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Stellaris Robotic Evaluation Board With Micrium's  µC/OS-III Stellaris Robotic Evaluation Board With Micrium's µC/OS-III
This cost-effective bundle combines the Stellaris Robotic Evaluation Board with the Micrium µC/OS-III: The Real-Time Kernel book by Jean J. Labrosse. The book puts the spotlight on how a real-time kernel works by using Micrium’s µC/OS-III as a descriptive reference in part one, and then putting the concepts into practice with example projects that use the richly-featured and just plain fun Texas Instruments EVM-EVALBOT robotic evaluation board. The book and EVALBOT are also sold separately.

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Stellaris ZigBee® Networking Kit (DK-EM2-2520Z) Stellaris ZigBee® Networking Kit (DK-EM2-2520Z)
Merging the performance and ease-of-use of Stellaris® ARM® Cortex™-M3-based microcontrollers (MCU) with leading wireless connectivity solutions, TI extends its portfolio with the new Stellaris ZigBee Networking Kit (DK-EM2-2520Z). The kit serves as a modular extension to TI’s Stellaris DK-LM3S9B96 development kit to give engineers complete software and reference design solutions for adding ZigBee capabilities to designs. With this offering, TI is building on its broad portfolio of 16-bit, ultra-low-power MSP430™-based wireless connectivity solutions, now providing 32-bit Stellaris MCU performance for execution of additional advanced connectivity and control functions.

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TMDSPLCKIT-V2 plcSuite Software Library TMDSPLCKIT-V2 plcSuite Software Library
TI offers its comprehensive plcSUITE, a modular software framework separating modulation, protocol and application development to extend the maximum flexibility to developers in testing and designing with PLC modems. With its flexible PLC modem solution (TMDSPLCKIT-V2) capable of supporting multiple standards and modulation schemes, TI is the only company able to deliver all of the key components required for today’s advanced Smart Grid applications.

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Introducing the MSP430 0.9-V Microcontroller - MSP430L092 Introducing the MSP430 0.9-V Microcontroller - MSP430L092
MSP430L092 MCU enables multiple applications to run from a single-cell battery and offers developers increased flexibility with programmable analog building blocks.

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Comparing MSP430F5xx Ultra-Low-Power Microcontrollers to early generation 2xx devices Comparing MSP430F5xx Ultra-Low-Power Microcontrollers to early generation 2xx devices
Find out when to consider MSP430F5xx ultra-low power microcontrollers for speed and performance versus feature-rich early generation MSP430's.

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Discover the benefits of MSP430F5xx Ultra-Low-Power Microcontrollers Discover the benefits of MSP430F5xx Ultra-Low-Power Microcontrollers
TI’s latest generation MSP430F5xx ultra-low-power microcontrollers provide designers with enhanced performance and increased design options with new and innovative peripherals on chips, which have more memory and integrated capabilities, while using less power than ever before.

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Teaching ROM Teaching ROM
The C2000 Teaching ROM is a free, downloadable set of learning materials consisting of chapters, presentations, and hands-on lab exercises. With the Teaching ROM, engineers of any background can quickly learn about C2000’s Delfino F2833x series of floating-point devices. Chapters cover the Code Composer Studio development environment, basics of DSP and microcontrollers, control peripherals, communication peripherals, software and tools, and also an overview of digital motor control and digital power.

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High-Voltage PFC Kit Overview High-Voltage PFC Kit Overview
The High Voltage Power Factor Correction kit (TMDSHVPFCKIT) demonstrates digital control of a 2-phase power factor correction stage. It has the ability to take line level AC power and convert it to DC power at up to 400V. Combined with software projects and libraries as part of controlSUITE, this kit represents a complete, full voltage system that models modern power factor correction implementations.

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Piccolo Control Law Accelerator Debug in CCSv4 Piccolo Control Law Accelerator Debug in CCSv4
This video will show you how to debug the C2000 Piccolo Control Law Accelerator (CLA) in Code Composer Studio V4.x

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Getting started with the high voltage motor control + PFC Getting started with the high voltage motor control + PFC
Learn how to get started with TMDSHVMTRPFCKIT using Piccolo or Delfino Real-Time Controllers.  Walk through the out-of-box experience, quickstart GUI, controlSUITE contents, and next steps.

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C2000 Digital Power Overview C2000 Digital Power Overview
Digital power addresses many of the challenges that analog power systems face today, but there are some significant barriers to switching over. Learn about the advantages of digital power, the challenges with digital power, and how C2000 provides the solutions with suite of software, hardware, and training.

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Taking Energy Efficiency to the Next Level Taking Energy Efficiency to the Next Level
This video discusses how the TMS320F2802x/F2803x Piccolo™ microcontrollers take energy efficiency to the next level by raising the level of integration while simultaneously reducing both the chip and system bill-of-materials (BOM) cost.

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C2000™ Piccolo™ DC/DC LED Developer's Kit C2000™ Piccolo™ DC/DC LED Developer's Kit
New C2000™ DC/DC LED Developer’s Kit based on TI’s Piccolo™ MCU includes complete hardware and software needed to digitally control up to 8 LED strings plus digital power supply with single Piccolo MCU.

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controlSUITE Demo controlSUITE Demo
Take a look into controlSUITE using the Piccolo controlSTICK as an example. Setting up the development tool only takes a few minutes. controlSUITE is a comprehensive and intuitive software suite designed to minimize software development time. From device-specific drivers and support software to complete system examples in sophisticated system applications, controlSUITE provides libraries and solutions for every stage of development and evaluation. controlSUITE also represents a single, centralized location for C2000 software that eliminates the search for dependencies and updates.

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C2000 Low voltage Dual-Axis Motor Control Kit Overview C2000 Low voltage Dual-Axis Motor Control Kit Overview
Overview of the hardware and software for the Piccolo based low voltage dual axis sensorless field oriented control plus power factor correction kit.

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C2000 High Voltage Motor Control and PFC Developer's Kit C2000 High Voltage Motor Control and PFC Developer's Kit
The High Voltage Motor Control and PFC Developer’s Kit offers customers an open source hardware and software platform to develop advanced motor control systems with digital power factor correction (PFC) using TI’s Piccolo microcontroller. Using TI’s Piccolo controlCARD, the PFC stage on the kit provides up to 750Watts of power to the motor driver stage, which can output 2 KiloWatts of power. Based on TI’s new controlSUITE software platform, the software included with the kit provides step by step documentation for closed loop PFC software and detailed examples and labs on controlling brushless DC , AC Induction, or permanent magnet synchronous motors.

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$4.30 MSP430 LaunchPad Kit for Value Line Devices $4.30 MSP430 LaunchPad Kit for Value Line Devices
Easily launch designs and do more for less, with the Value Line series of MSP430™ microcontrollers that deliver 16-bit performance and ultra-low power at 8-bit price.

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Inside Motor Control at TI - 32-Bit MCUs
Overview of C2000 32-bit real-time controllers for motor control applications, including devices, software, and hardware.

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Getting Started with the CC430 Sample Kit
The CC430 sample kit simplifies application development by providing a working RF hardware platform on which you can learn how the use the device. This video describes the contents of the sample kit, including the EM430F6137RF900 evaluation modules and accompanying hardware.

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Stellaris 13.56-MHz RFID Wireless Kit (DK-EM2-7960R) Stellaris 13.56-MHz RFID Wireless Kit (DK-EM2-7960R)
Merging the performance and ease-of-use of Stellaris® ARM® Cortex™-M3-based microcontrollers (MCU) with leading wireless connectivity solutions, TI extends its portfolio with the new Stellaris 13.56 MHz RFID Wireless Kit (DK-EM2-7960R). The kit serves as a modular extension to TI’s Stellaris DK-LM3S9B96 development kit to give engineers complete software and reference design solutions for adding RFID capabilities to designs. With this offering, TI is building on its broad portfolio of 16-bit, ultra-low-power MSP430™-based wireless connectivity solutions, now providing 32-bit Stellaris MCU performance for execution of additional advanced connectivity and control functions.

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Papers

Developing Android™ applications for ARM® Cortex™-A8 Cores New Developing Android™ applications for ARM® Cortex™-A8 Cores
The flexibility, power, versatility and ubiquity of the Android operating system (OS) and associated ecosystem have been a boon to developers of applications for ARM processor cores. Historically, Android has been widely deployed in mobile devices such as smartphones and tablets. Now, Android is expanding beyond its origins and migrating into a wider array of applications and products. products. TI’s OMAP™ processors provide a best-in-class foundation for Android designs in the mobile market today. In fact, TI’s OMAP4460 processor was selected as the platform for Android 4.0 development. But the mobile market is not the only space in which Android is fast expanding, which is why all TI platforms – OMAP, Sitara™ ARM processors, DaVinci™ video processors and C6000™ DSP+ARM processors – are moving into many other spaces outside mobile devices.

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Paving the path for wireless capacity expansion New Paving the path for wireless capacity expansion
Various predictions of data demand on wireless networks over the next three to ten years show significant growth, outpacing the predicted network capacity. Operators can act defensively and start installing data usage monitoring and throttling mechanisms, or they can go on the offensive and establish network topologies and advanced techniques to maximize network capacity. Wireless base station manufacturers play an important role in this capacity strategy, but can face numerous challenges in doing so. This white paper explores some of the techniques that operators can use to increase capacity and their relative costs and discusses how Texas Instruments’ new TCI6636 SoC plays a plays a key role in enabling OEMs to meet this capacity challenge.

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Gesture recognition: Enabling natural interactions with electronics New Gesture recognition: Enabling natural interactions with electronics
Gesture recognition is becoming a commonplace technology, enabling humans and machines to interface more easily in the home, the automobile and at work. Gesture recognition has long been researched with 2D vision, but with the advent of 3D sensor technology, its applications are now more diverse, spanning a variety of markets. TI offers a complete solution, including a range of processors, tools and comprehensive software, to enable customers to quickly and easily bring leading 3D vision products to market. TI continues to innovate to meet market challenges, leading to even greater adoption of gesture and 3D applications beyond the consumer electronics market.

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Improve perceptual video quality: Skin-tone macroblock detection New Improve perceptual video quality: Skin-tone macroblock detection
To improve the overall perceived quality of images that focus on human faces, skin-tone macroblock detection offers a low-complexity solution. This paper shows how different techniques can be implemented in order to increase accuracy and maintain HD channel density for real-time pre-processing of the ROI detection algorithm on TI’s DSPs, including the C674x DSP on TI’s DaVinci DM816x video processor. TI’s VTC demo offers the option of ROI H.264 encoding and a real-time visualization of ROI detection.

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Session Border Controller Selection New Session Border Controller Selection
Today, SBCs typically use a general-purpose processor to implement control, signaling and management function. Specialized hardware in the form of DSPs is added for efficient transcoding, tone processing, facsimile and any other signal-processing operations that require more intense processing. In this white paper we explore how DSPs can add value and flexibility to SBCs and provide a “turbo-charged” solution.

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Ultra-low-power pioneers: TI slashes total MCU power by 50 percent with new Wolverine MCU platform Ultra-low-power pioneers: TI slashes total MCU power by 50 percent with new Wolverine MCU platform
TI achieves the Wolverine platform’s impressive power gains through its new 130-nm ultra-low-leakage (ULL) process technology, integrated low-power non-volatile memory and enhanced MSP430 DNA with advanced power management and precision low-power analog.

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Power Protection System: Design considerations for cost effective, easy-to-integrate SoC-based power line protection equipment Power Protection System: Design considerations for cost effective, easy-to-integrate SoC-based power line protection equipment
To protect capital investment, improve operating efficiency and reduce damage and injury caused by electrical faults and outages, power protection systems are being built into a wide range of industrial and commercial power networks. A power protection system is a remote device located outside of a building that monitors the power line for surges. If a surge is detected, information will be sent to a control office and some action will be taken. These products must have powerful signal-processing capability, a rich set of I/O peripherals to support high data rates, an intuitive graphical user interface (GUI), low power consumption to assure a long lifetime in a high-heat environment and high-quality baseline software to speed system design and time-to-market.

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2012 TI Smart Grid Solutions Guide 2012 TI Smart Grid Solutions Guide
TI is your global smart grid systems partner for secure, economical and future-proof grid.

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Embedded software development is a multi-dimensional effort Embedded software development is a multi-dimensional effort
Designing, developing, integrating and deploying a complete software system for an embedded application involves a large number of interrelated questions and optimization tradeoffs. With proper planning, such a challenge can be efficiently mastered resulting in a highly differentiated solution. No matter the application for which you’re developing, there are a myriad of considerations. Our hope is that the topics and considerations discussed above have helped you in your embedded design.

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EtherCAT® on Sitara™ AM335x ARM® Cortex™-A8 Microprocessors EtherCAT® on Sitara™ AM335x ARM® Cortex™-A8 Microprocessors
Texas Instruments is world’s first semiconductor company to license EtherCAT technology and integrate it into the Sitara AM335x ARM generation of ARM Cortex-A8-based microprocessors (MPUs). This whitepaper explores implementation of this technology on the AM335x processor through its programmable real-time unit (PRU)-based programmable technology to create a unified front-end for industrial communications and bring EtherCAT and other industrial standards to its growing platform of ARM-based microprocessors.

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Comparing TI’s TMS320C6671 DSP with ADI’s ADSP-TS201S TigerSHARC® Processor Comparing TI’s TMS320C6671 DSP with ADI’s ADSP-TS201S TigerSHARC® Processor
Texas Instruments’ new TMS320C6671 DSP brings fixed- and floating-point computational capability to the industry's fastest single-core DSP. This makes TI’s C6671 a viable alternative for designs based on existing single-core floating-point DSPs in the industry, such as Analog Devices' (ADI) TigerSHARC® processor family. This white paper examines how TI’s C6671 DSP not only provides hardware features to implement system- level functions, but goes much further by providing multiple options for implementing additional functions that make it a significantly more powerful single-core DSP than ADI’s ADSP-TS2012 TigerSHARC processor.

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Network coprocessors are altering the makeup of gateway systems Network coprocessors are altering the makeup of gateway systems
This paper examines the evolution of media gateways, the role that TI’s digital signal processing (DSP) technology has played in this evolution and how the emergence of the network coprocessor (NetCP) is currently altering the makeup of next-generation media gateways. In particular, the integration of previously disparate processing elements such as Ethernet switching, packet and security acceleration subsystems and others into one cohesive processing architecture is explained relative to how this phenomenon is enabling the seamless integration of legacy architectures with newer innovations.

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Creating cloud base stations with TI’s KeyStone multicore architecture Creating cloud base stations with TI’s KeyStone multicore architecture
The Cloud RAN (Radio Access Network) is a hot topic in the wireless community. Cloud RAN takes its place along with small cells, distributed antenna systems (DAS), ac¬tive antenna arrays (AAA) and remote radio heads (RRH) that are being considered, or in some cases deployed, to address wire¬less issues ranging from site acquisition, to coverage and capacity enhancement, to environmental stewardship (green base sta¬tions). This paper explores how TI is scaling its KeyStone multicore architecture for the emerging paradigm of C-RAN base stations, enabling the creation of device pools with immense capacity for manufacturers to develop extremely high performance and power efficient C-RAN base station clusters.

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TMS320C553x DSPs - Industry’s lowest power DSPs now at the unbelievable price of $1.95 TMS320C553x DSPs - Industry’s lowest power DSPs now at the unbelievable price of $1.95
Texas Instruments’ new ultra-low-power TMS320C553x DSPs include the lowest price fixed-point 16-bit DSPs in the industry by 30 percent. This generation of power-effi cient DSPs is the fi rst to break the U.S. $2 DSP barrier and includes the TMS320C5532, TMS320C5533, TMS320C5534, and TMS320C5535 DSPs.

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TMS320C5535 eZdsp - USB Development Kit TMS320C5535 eZdsp - USB Development Kit
The TMDX5535eZdsp is a small form factor, very-low-cost USB-powered DSP development kit which includes hardware and software needed to evaluate the C553x generation, which is the industry’s lowest-cost and lowest-power 16-bit DSP. This ultra-low-cost kit allows quick and easy evaluation of the advanced capabilities of the C5532, C5533, C5534 and C5535 processors.

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Estimating Power Consumption on the TMS320C5504/05/14/15/32/33/34/35 DSPs Estimating Power Consumption on the TMS320C5504/05/14/15/32/33/34/35 DSPs
This document assists in estimating the power consumption for the TMS320C5504/C5505/C5514/C5515 and TMS320C5532/C5533/C5534/C5535 digital signal processors (DSPs). Power consumption on these devices is highly application-dependent, so a spreadsheet is provided to estimate power consumption. The spreadsheet allows you to enter parameters that closely resemble the application and generate a realistic estimate of DSP power consumption based on your input. It also allows designers the ability to test the efficiency of different configurations before they assemble any hardware or write any code.

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Migrating from TMS320C5515/05 to TMS320C5535/34/33/32 Migrating from TMS320C5515/05 to TMS320C5535/34/33/32
Texas InstruThis document provides the minimum changes required to migrate from TMS320C5515/05 to TMS320C5535/34/33/32. Enhancements or new features of the TMS320C5535/34/33/32 devices that do not affect migrating from the TMS320C5515/05 devices will also be briefly mentioned in this document.

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Using the TMS320C5535/34/33/32 Bootloader Using the TMS320C5535/34/33/32 Bootloader
This document describes the features of the on-chip ROM for the TMS320C5535/34/33/32 digital-signal processors. Included is a description of the bootloader and how to interface with it for each of the possible boot devices, as well as instructions for generating a boot image to store on an external device.

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Enabling multistandard wireless base stations with TI’s KeyStone SoCs Enabling multistandard wireless base stations with TI’s KeyStone SoCs
Since its inception, the wireless market has grown rapidly. At first, growth was measured as subscriber growth with a focus on voice, but now, it is measured by data rate and throughput improvements. Arguably wireless spectrum is the wireless operators’ most precious resource. As such, an operator’s ultimate measuring stick is the number of bits transmitted per Hertz of spectrum. The migration to LTE promises the highest spectral efficiency along with higher capacities at optimal costs. Despite the promise of LTE, operators must continue to support current customers on existing deployed technologies as well as optimize the use of the spectrum they currently own, while planning and implementing their ultimate 4G migration.

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TI AM335x ARM Cortex-A8 Microprocessors TI AM335x ARM Cortex-A8 Microprocessors
Texas Instruments (TI) continues to optimize and expand its portfolio of industry-leading ARM microprocessors (MPUs) with six new AM335x devices that deliver new levels of integration at very low price points. The AM335x ARM MPUs offer the highest DMIPs per dollar while delivering optional 3D graphics acceleration and key peripherals. The combination of graphics and connectivity support makes this solution ideal for portable navigation systems, handheld gaming devices, and home/building automation solutions. The AM335x ARM MPU includes support for a robust set of software solutions.

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AM387x ARM® Cortex™-A8 Microprocessors AM387x ARM® Cortex™-A8 Microprocessors
Texas Instruments (TI) continues to expand its portfolio of industry-leading ARM microprocessors (MPUs) with new AM387x devices that deliver unparalleled connectivity and scalability. Featuring a high-performance single-core ARM Cortex-A8, the AM387x ARM MPUs enable faster end products with complete system control, network connectivity, graphical user interfaces and display capabilities and the ability to run multiple applications simultaneously on advanced operating systems, all at less than 2 Watts of power consumption. Offering ARM performance at up to 1 GHz, the AM387x ARM MPUs are perfect for fan-less industrial, networking, and communications applications, such as industrial human machine interface systems, multi-protocol industrial control, wireless access points, and network attached storage.

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ARM® Cortex™-A8-based DM3730 DaVinci™ digital media ARM® Cortex™-A8-based DM3730 DaVinci™ digital media
Golden-i headsets are cutting edge devices activated by hands-free natural speech recognition and user gestures to enable fi eld-based medical, public safety, industrial and construction professionals hands-free job performance.

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Low-power DSP uses in connected audio applications Low-power DSP uses in connected audio applications
This white paper addresses the challenge to add more features in peripheral device systems to improve sound and voice quality. Peripheral audio devices are moving towards adding more complex features such as AEC, SRC, surround sound, audio mix, and even wireless capability. In this paper, a base audio device system will be defined and then algorithms and software will be introduced to improve the user experience with better sound quality provided by the DSP industry’s lowest power DSP, the TMS320C5505/15/35.

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TMS320C66x multicore DSPs for high-end industrial automation TMS320C66x multicore DSPs for high-end industrial automation
Texas Instruments’ TMS320C66x multicore DSPs offer the high accuracy, real-time performance and easy-to-use software and development tools required for processing-intensive industrial applications.
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Discrete Applications White Paper Discrete Applications White Paper


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TI’s e-book development platform TI’s e-book development platform


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TRAINING: How to Install the AM37x Software Development Kit (SDK) TRAINING: How to Install the AM37x Software Development Kit (SDK)
Step-by-step instructions on how to install the AM37x Linux SDK to get up and running with development on the AM3715 or AM3703.

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OpenCV on TI’s DSP+ARM® platforms: Mitigating the challenges of porting OpenCV to embedded platforms OpenCV on TI’s DSP+ARM® platforms: Mitigating the challenges of porting OpenCV to embedded platforms
In today’s advancing market, the growing performance and decreasing price of embedded processors are opening many doors for developers to design highly sophisticated solutions for different end applications. The complexities of these systems can create bottlenecks for developers in the form of longer development times, more complicated development environments and issues with application stability and quality. Developers can address these problems using sophisticated software packages such as OpenCV, but migrating this software to embedded platforms poses its own set of challenges. This paper will review how to mitigate some of these issues, including C++ implementation, memory constraints, floating-point support and opportunities to maximize performance using vendor-optimized libraries and integrated accelerators or co-processors. Finally, we will introduce a new effort by Texas Instruments (TI) to optimize vision systems by running OpenCV on the C6000™ digital signal processor (DSP) architecture. Benchmarks will show the advantage of using the DSP by comparing the performance of a DSP+ARM® system-on-chip (SoC) processor against an ARM-only device.
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Intelligent I/O processing for DSP+ARM® SoCs Intelligent I/O processing for DSP+ARM® SoCs
This white paper discusses results of input/output (I/O) processing on the general-purpose processor (GPP) for a DSP-centric programming model using a system-on-chip (SoC) containing both digital signal processor (DSP) and ARM® cores.

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Power management in embedded systems with dual OSes Power management in embedded systems with dual OSes
In today’s system-on-chip (SoC) platforms containing multiple heterogenous processors, the system architect needs to know how to deal with power management facilities provided with different operating systems (OSes) running on them to balance the overall system power policies.
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KeyStone Multicore SoC tool suite: one platform for all needs KeyStone Multicore SoC tool suite: one platform for all needs
Historically, a signifi cant challenge in implementing and deploying multicore System-on-Chip (SoC) devices has been the availability of proper tools to program and debug these platforms. For developers to take full advantage of the performance of multiple cores, effi ciently partitioned and high quality software running on those cores is crucial. The debugging of complex multicore systems comes with additional complexity from their concurrent processing paradigm and the limited accessibility of sub-system interfaces. The strength of a tool suite is measured by the time it takes to develop and debug multicore SoCs, and the ability to achieve optimal SoC performance.

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Embedded technologies are helping the video security industry ‘go green’ Embedded technologies are helping the video security industry ‘go green’
Going green isn’t just a trend. It’s a necessity today because of obvious environmental reasons. Most industries have started taking a green approach, but semiconductor manufacturers have taken this challenge very seriously for much longer than just the past few years.

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Multicore software development kit Multicore software development kit
Multicore digital signal processors (DSPs) are starting to find increasing acceptance in various market segments, including test and measurement, mission critical, industrial automation, medical and high-end imaging equipment, and high-performance computing. As processing demands of these applications continue to increase, Texas Instruments has responded with a new generation of scalable, high-performance TMS320C66x multicore DSPs. The C66x devices are based on TI’s KeyStone architecture which is the platform for true multicore innovation by providing full processing capability to every core in a multicore device. TI’s C66x high performance DSPs include pin-compatible and scalable devices available in one, two, four and eight-core configurations.

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Programmable Real-Time Unit (PRU): Extending Functionality of Existing SoCs Programmable Real-Time Unit (PRU): Extending Functionality of Existing SoCs
As the complexity of applications implemented on SoC devices continues to increase, higher performance and many different connectivity options are required. TI continues to extend the capabilities of its SoCs by providing more connectivity options with every new generation.

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Software and hardware design challenges due to the dynamic raw NAND market Software and hardware design challenges due to the dynamic raw NAND market
This white paper will highlight the difficulties in developing and maintaining fi rmware (bootloaders), middleware (OS/application drivers) and hardware IPs for interfacing with raw NAND devices. Determining raw NAND geometry, NAND command set and ECC requirements across NAND manufacturers and NAND product lines, combined with short life cycle of raw NAND, brings significant challenges to both software and hardware designers. Various approaches to resolve the issue will be discussed. Managed NAND as an alternative solution will also be examined.

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AM1808/OMAP-L138+WL1271 AM1808/OMAP-L138+WL1271

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The role of multicore in the evolution of communications The role of multicore in the evolution of communications
In the last decade we have experienced huge changes in the way we communicate. We have moved from fixed and wired plain old telephone service (POTS) to briefcase-sized mobile phones, and more recently to smartphones. Behind the scenes we have moved seamlessly from the circuit switched technology of the public switched telephone network (PSTN) and early cellular networks to the packet switched technologies of the Internet. The growth in user services has placed pressure on service providers to support new applications (Figure 1) while maintaining their traditional quality. These services are supported by next-generation components and features in the backbone or transport networks. This makes the processing requirements of the backbone telecommunications networks a perfect example of the forces which are creating the need for multicore processor architectures.

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Customizable system interfaces add value to embedded processors Customizable system interfaces add value to embedded processors
Standard interfaces integrated into an embedded processor helps ease a system designer’s work by providing interoperability with other products and reducing design cost and cycle time. But they can also make the choice of an embedded processor a bit problematic.

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Delivering performance,  efficiency and differentiation  with TI’s multistandard base station SoC Delivering performance, efficiency and differentiation with TI’s multistandard base station SoC
With increasing consumer demand for smartphones and the popularity of wireless PC tablets, the mobile Internet is today connecting more and more users and consequently demanding a substantial increase in capacity of the mobile network.

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Enabling multistandard wireless base stations with TI's KeyStone SoCs Enabling multistandard wireless base stations with TI's KeyStone SoCs
'Since its inception, the wireless market has grown rapidly. At first, growth was measured as subscriber growth with a focus on voice, but now, it is measured by data rate and throughput improvements. Arguably wireless spectrum is the wireless operators’ most precious resource. As such, an operator’s ultimate measuring stick is the number of bits transmitted per Hertz of spectrum.'

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C6Accel: TI SoC developers accelerate performance with ready-to-use DSP kernels C6Accel: TI SoC developers accelerate performance with ready-to-use DSP kernels
C6Accel simplifies the ARM user experience in leveraging the DSP by providing a library of ARM APIs. These APIs abstract complexities of using DSP in a multi-core SoC environment.

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C6A816x Integra DSP+ARM Processors C6A816x Integra DSP+ARM Processors
Texas Instruments continues to expand the performance of its processors with the new C6A816x Integra™ DSP+ARM processor generation, featuring the highest performing floating- and fixed-point digital signal processor (DSP) on the market today.

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Maximizing the Power of ARM with DSP Maximizing the Power of ARM with DSP
Texas Instruments’ (TI) Integra™ DSP+ARM devices combine a digital signal processor (DSP) and an ARM® processor, enabling developers to create applications best suited for executing a combination of signal processing tasks and microprocessor (MPU) tasks. This paper reviews the benefits of combining ARM processing with DSP processing in a single chip, including increased real-time performance, improved system flexibility and reduced system cost and power. Integra DSP+ARM processors are useful for applications such as power protection systems, industrial control, machine vision and tracking and control.

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TI’s new C66x fixed- and floating-point DSP core conquers the ‘Need for Speed’ TI’s new C66x fixed- and floating-point DSP core conquers the ‘Need for Speed’
Texas Instruments’ (TI’s) new TMS320C66x digital signal processor (DSP) core brings significant performance enhancement to the award-winning C64x+™ instruction set architecture (ISA) and incorporates support for floating- point computations in the same processing core.

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AM389x Sitara™ ARM® Microprocessors AM389x Sitara™ ARM® Microprocessors
Texas Instruments expands its portfolio of industry-leading Sitara™ ARM microprocessors (MPUs) with new AM389x devices that dramatically boost performance and integration.

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AM3715 Data Sheet AM3715 Data Sheet
The AM37x family of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology.

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AM1808 Data Sheet AM1808 Data Sheet
The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

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Programmable Real-Time Unit (PRU): Extending Functionality of Existing SoCs Programmable Real-Time Unit (PRU): Extending Functionality of Existing SoCs
"As the complexity of applications implemented on system-on-a-chip (SoC) devices continues to increase, higher performance and many different connectivity options are required. Texas Instruments Inc. continues to extend the capabilities of its SoCs by providing more connectivity options with every new generation."

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C5515 Fingerprint Development Kit C5515 Fingerprint Development Kit
At only $79 (USD), the TMS320C5515 Fingerprint Development Kit (FDK) is a complete signal chain solution that offers easy integration of fingerprint biometric features in reduced time to market.

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ARM Platform Technical Overview
The high-performance Sitara product family is one of the new TI ARM solutions which offer the right combination of application-specific peripherals, packages and temperature ranges as well as the complete signal chain including analog, power and mixed.

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Migrating From MSP430F2xx to MSP430FR5xx Family Migrating From MSP430F2xx to MSP430FR5xx Family
This application report enables easy migration from MSP430F2xx Flash-based MCUs to the MSP430FR57xx family FRAM-based MCU. It covers programming, system, and peripheral considerations when migrating firmware. The purpose is to highlight differences between the two families.

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Hercules™ Microcontrollers: Real-time MCUs for safety-critical products Hercules™ Microcontrollers: Real-time MCUs for safety-critical products
Electronics continue to play a major role in products where functional safety is the most important consideration. Ensuring that products meet the stringent functional safety requirements of standards such as IEC61508 or ISO 26262 is a complicated task that requires strict processes, analyses, thoughtful system design, and more. The Hercules microcontroller platform is the culmination of TI’s long history of developing MCUs for safety-critical systems, providing a broad portfolio of devices specifically designed to meet the requirements of safety-critical medical, industrial, and transportation applications. This whitepaper will dive deeper into the new platform and how it helps designers make the world

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Hercules™ Safety Microcontrollers Hercules™ Safety Microcontrollers
Hercules safety microcontrollers are based on TI’s 20+ years of safety-critical system expertise, industry collaboration and proven hardware for the automotive market. The platform consists of three ARM® Cortex™-based microcontroller families (RM48x, TMS570 and TMS470M) that deliver scalable performance, connectivity, memory and safety features. Unlike many microcontrollers that rely heavily on software for safety capabilities, Hercules microcontrollers implement safety in hardware to maximize performance and reduce software overhead.

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Performance without Compromise: Implementing Real-time Control and Communications with a dual-subsystem microcontroller Performance without Compromise: Implementing Real-time Control and Communications with a dual-subsystem microcontroller
With the growing importance of energy efficiency and smart grid technology, there is an increasing need for reliable silicon that supports real-time control with an interface capable of connecting to a wider network. Many robotic and automation applications, for example, have drive systems managing multiple motors that need to coordinate with a larger subsystem to enable intelligent monitoring and remote control. Similarly, a wide range of green applications such as solar inverters are using communication links to increase the individual operating efficiency of an array of devices. Communications are also required to increase the safety and reliability of many other embedded and industrial systems.

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The Stellaris® Graphics Library Makes Short Order of Assembling a Dynamic HMI The Stellaris® Graphics Library Makes Short Order of Assembling a Dynamic HMI
A well-designed human machine interface (HMI) can be a major selling point for an embedded electronic system. From medical instruments and consumer devices to industrial controls, a nice display with intuitive controls can combine style with functionality to make it easy for a user to set, monitor, and operate the equipment. This white paper demonstrates how to quickly and easily construct a visually appealing display and control center leveraging the Stellaris ARM-Cortex-M3-based microcontroller to run the system, some well-defined graphics primitives and applications widgets from the StellarisWare® Graphics Library. A number of HMI examples are shown in this paper demonstrate the library’s potential.

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Selection Guide: TI processors based on ARM® technololgy Selection Guide: TI processors based on ARM® technololgy
Learn how to get started with TI's ARM devices, kits and tools. As the leader with the broadest ARM portfolio, TI offers you experience and expertise in designing with ARM cores including the Stellaris® ARM® Cortex™ - M3.

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C2000™ Piccolo™ MCU Multi-DC/DC Color LED Kit C2000™ Piccolo™ MCU Multi-DC/DC Color LED Kit
Introducing the new C2000 Multi-DC/DC Color LED Developer’s Kit, based on TI’s Piccolo MCU. The kit features digital control of a multi-string LED design implementation driven by multiple, independent DC/DC power stages. This video provides a brief introduction to the kit as well as a demonstration showcasing color mixing.

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Power Line Communications Solutions Power Line Communications Solutions
Hardware and software solutions for PLC and metering infrastructure.

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C2000 VCU, Viterbi, Complex Math, and CRC C2000 VCU, Viterbi, Complex Math, and CRC
Boosting the performance of C2000(TM) MCUs This video explains the exciting new feature called the VCU, or Viterbi, Complex Math and CRC unit. VCU adds exciting CPU processing capabilities to the new C2000™ Piccolo™ F2806x series of microcontrollers. As the name implies, VCU adds a complex math arithmetic unit, a Viterbi unit, and a Cyclic redundancy check (CRC) unit.

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DRV8412-C2-KIT, Brushed DC and Stepper Motor Control Kit DRV8412-C2-KIT, Brushed DC and Stepper Motor Control Kit
Overview of how to get started with TI's Brushed DC and Stepper Motor Control Kit, featuring the Piccolo F28035 controlCARD and the DRV8412 Integrated Motor Driver

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Low-cost Real-time Floating Point MCU: Piccolo™ F2806x MCU Low-cost Real-time Floating Point MCU: Piccolo™ F2806x MCU
The new C2000™ Piccolo F2806x MCUs bring developers more integration as well as the precision and programming benefits of floating-point at a low cost. By bridging the low-cost Piccolo and floating-point Delfino line developers have the price, performance and peripheral options they need to drive development of energy-efficient real-time control applications.

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C2000 Real-Time Features C2000 Real-Time Features
C2000 has two very useful features called real-time mode and real-time interrupts. They can be of great use when debugging software. Learn more about real-time mode and real-time interrupts and watch a demo of how to operate them in Code Composer IDE with an example from controlSUITE.

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ControlSUITE Desktop ControlSUITE Desktop
controlSUITE Desktop is a powerful utility that brings all C2000 software and resources into one easy-to-use interface. controlSUITE Desktop ensures access to the latest versions of kit and device software, datasheets, user guides, application notes, and more from your computer.

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Crosshairs Embedded Crosshairs Embedded
Crosshairs Embedded creates innovative software aimed to make microcontroller and DSP systems more efficient and easier to manage. Learn about Crosshairs Embedded's latest products, including the powerful Functional Debugger and the Interface Designer for advanced monitoring.

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Stellaris 2.4-GHz SimpliciTI™ Wireless Kit (DK-EM2-2500S) Stellaris 2.4-GHz SimpliciTI™ Wireless Kit (DK-EM2-2500S)
Merging the performance and ease-of-use of Stellaris® ARM® Cortex™-M3-based microcontrollers (MCU) with leading wireless connectivity solutions, TI extends its portfolio with the new Stellaris 2.4 GHz SimpliciTI™ Wireless Kit (DK-EM2-2500S). The kit serves as a modular extension to TI’s Stellaris DK-LM3S9B96 development kit to give engineers complete software and reference design solutions for adding low power RF capabilities to designs. With this offering, TI is building on its broad portfolio of 16-bit, ultra-low-power MSP430™-based wireless connectivity solutions, now providing 32-bit Stellaris MCU performance for execution of additional advanced connectivity and control functions.

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Stellaris for Wireless Connectivity Solutions Stellaris for Wireless Connectivity Solutions
Merging the performance and ease-of-use of Stellaris® ARM® Cortex™-M3-based microcontrollers (MCU) with leading wireless connectivity solutions, TI adds three new wireless kits. The kits serve as modular extensions to TI’s Stellaris DK-LM3S9B96 development kit to give engineers complete software and reference design solutions for adding RFID, low-power RF and ZigBee capabilities to designs. With this offering, TI is building on its broad portfolio of 16-bit, ultra-low-power MSP430™-based wireless connectivity solutions, now providing 32-bit Stellaris MCU performance for execution of additional advanced connectivity and control functions.

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Stellaris Robotic Evaluation Board With Micrium's  µC/OS-III Stellaris Robotic Evaluation Board With Micrium's µC/OS-III
This cost-effective bundle combines the Stellaris Robotic Evaluation Board with the Micrium µC/OS-III: The Real-Time Kernel book by Jean J. Labrosse. The book puts the spotlight on how a real-time kernel works by using Micrium’s µC/OS-III as a descriptive reference in part one, and then putting the concepts into practice with example projects that use the richly-featured and just plain fun Texas Instruments EVM-EVALBOT robotic evaluation board. The book and EVALBOT are also sold separately.

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Stellaris ZigBee® Networking Kit (DK-EM2-2520Z) Stellaris ZigBee® Networking Kit (DK-EM2-2520Z)
Merging the performance and ease-of-use of Stellaris® ARM® Cortex™-M3-based microcontrollers (MCU) with leading wireless connectivity solutions, TI extends its portfolio with the new Stellaris ZigBee Networking Kit (DK-EM2-2520Z). The kit serves as a modular extension to TI’s Stellaris DK-LM3S9B96 development kit to give engineers complete software and reference design solutions for adding ZigBee capabilities to designs. With this offering, TI is building on its broad portfolio of 16-bit, ultra-low-power MSP430™-based wireless connectivity solutions, now providing 32-bit Stellaris MCU performance for execution of additional advanced connectivity and control functions.

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TMDSPLCKIT-V2 plcSuite Software Library TMDSPLCKIT-V2 plcSuite Software Library
TI offers its comprehensive plcSUITE, a modular software framework separating modulation, protocol and application development to extend the maximum flexibility to developers in testing and designing with PLC modems. With its flexible PLC modem solution (TMDSPLCKIT-V2) capable of supporting multiple standards and modulation schemes, TI is the only company able to deliver all of the key components required for today’s advanced Smart Grid applications.

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Introducing the MSP430 0.9-V Microcontroller - MSP430L092 Introducing the MSP430 0.9-V Microcontroller - MSP430L092
MSP430L092 MCU enables multiple applications to run from a single-cell battery and offers developers increased flexibility with programmable analog building blocks.

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Comparing MSP430F5xx Ultra-Low-Power Microcontrollers to early generation 2xx devices Comparing MSP430F5xx Ultra-Low-Power Microcontrollers to early generation 2xx devices
Find out when to consider MSP430F5xx ultra-low power microcontrollers for speed and performance versus feature-rich early generation MSP430's.

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Discover the benefits of MSP430F5xx Ultra-Low-Power Microcontrollers Discover the benefits of MSP430F5xx Ultra-Low-Power Microcontrollers
TI’s latest generation MSP430F5xx ultra-low-power microcontrollers provide designers with enhanced performance and increased design options with new and innovative peripherals on chips, which have more memory and integrated capabilities, while using less power than ever before.

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Teaching ROM Teaching ROM
The C2000 Teaching ROM is a free, downloadable set of learning materials consisting of chapters, presentations, and hands-on lab exercises. With the Teaching ROM, engineers of any background can quickly learn about C2000’s Delfino F2833x series of floating-point devices. Chapters cover the Code Composer Studio development environment, basics of DSP and microcontrollers, control peripherals, communication peripherals, software and tools, and also an overview of digital motor control and digital power.

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High-Voltage PFC Kit Overview High-Voltage PFC Kit Overview
The High Voltage Power Factor Correction kit (TMDSHVPFCKIT) demonstrates digital control of a 2-phase power factor correction stage. It has the ability to take line level AC power and convert it to DC power at up to 400V. Combined with software projects and libraries as part of controlSUITE, this kit represents a complete, full voltage system that models modern power factor correction implementations.

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Piccolo Control Law Accelerator Debug in CCSv4 Piccolo Control Law Accelerator Debug in CCSv4
This video will show you how to debug the C2000 Piccolo Control Law Accelerator (CLA) in Code Composer Studio V4.x

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Getting started with the high voltage motor control + PFC Getting started with the high voltage motor control + PFC
Learn how to get started with TMDSHVMTRPFCKIT using Piccolo or Delfino Real-Time Controllers.  Walk through the out-of-box experience, quickstart GUI, controlSUITE contents, and next steps.

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C2000 Digital Power Overview C2000 Digital Power Overview
Digital power addresses many of the challenges that analog power systems face today, but there are some significant barriers to switching over. Learn about the advantages of digital power, the challenges with digital power, and how C2000 provides the solutions with suite of software, hardware, and training.

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Taking Energy Efficiency to the Next Level Taking Energy Efficiency to the Next Level
This video discusses how the TMS320F2802x/F2803x Piccolo™ microcontrollers take energy efficiency to the next level by raising the level of integration while simultaneously reducing both the chip and system bill-of-materials (BOM) cost.

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C2000™ Piccolo™ DC/DC LED Developer's Kit C2000™ Piccolo™ DC/DC LED Developer's Kit
New C2000™ DC/DC LED Developer’s Kit based on TI’s Piccolo™ MCU includes complete hardware and software needed to digitally control up to 8 LED strings plus digital power supply with single Piccolo MCU.

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controlSUITE Demo controlSUITE Demo
Take a look into controlSUITE using the Piccolo controlSTICK as an example. Setting up the development tool only takes a few minutes. controlSUITE is a comprehensive and intuitive software suite designed to minimize software development time. From device-specific drivers and support software to complete system examples in sophisticated system applications, controlSUITE provides libraries and solutions for every stage of development and evaluation. controlSUITE also represents a single, centralized location for C2000 software that eliminates the search for dependencies and updates.

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C2000 Low voltage Dual-Axis Motor Control Kit Overview C2000 Low voltage Dual-Axis Motor Control Kit Overview
Overview of the hardware and software for the Piccolo based low voltage dual axis sensorless field oriented control plus power factor correction kit.

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C2000 High Voltage Motor Control and PFC Developer's Kit C2000 High Voltage Motor Control and PFC Developer's Kit
The High Voltage Motor Control and PFC Developer’s Kit offers customers an open source hardware and software platform to develop advanced motor control systems with digital power factor correction (PFC) using TI’s Piccolo microcontroller. Using TI’s Piccolo controlCARD, the PFC stage on the kit provides up to 750Watts of power to the motor driver stage, which can output 2 KiloWatts of power. Based on TI’s new controlSUITE software platform, the software included with the kit provides step by step documentation for closed loop PFC software and detailed examples and labs on controlling brushless DC , AC Induction, or permanent magnet synchronous motors.

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$4.30 MSP430 LaunchPad Kit for Value Line Devices $4.30 MSP430 LaunchPad Kit for Value Line Devices
Easily launch designs and do more for less, with the Value Line series of MSP430™ microcontrollers that deliver 16-bit performance and ultra-low power at 8-bit price.

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Inside Motor Control at TI - 32-Bit MCUs
Overview of C2000 32-bit real-time controllers for motor control applications, including devices, software, and hardware.

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Getting Started with the CC430 Sample Kit
The CC430 sample kit simplifies application development by providing a working RF hardware platform on which you can learn how the use the device. This video describes the contents of the sample kit, including the EM430F6137RF900 evaluation modules and accompanying hardware.

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eZ430-Chronos development tool
The eZ430-Chronos represents a new era in development - a customizable development environment within a sports watch. The kit allows developers to easily harness the leading integration, ultra-low power and wireless capabilities of TI's CC430 MCU.

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Stellaris 13.56-MHz RFID Wireless Kit (DK-EM2-7960R) Stellaris 13.56-MHz RFID Wireless Kit (DK-EM2-7960R)
Merging the performance and ease-of-use of Stellaris® ARM® Cortex™-M3-based microcontrollers (MCU) with leading wireless connectivity solutions, TI extends its portfolio with the new Stellaris 13.56 MHz RFID Wireless Kit (DK-EM2-7960R). The kit serves as a modular extension to TI’s Stellaris DK-LM3S9B96 development kit to give engineers complete software and reference design solutions for adding RFID capabilities to designs. With this offering, TI is building on its broad portfolio of 16-bit, ultra-low-power MSP430™-based wireless connectivity solutions, now providing 32-bit Stellaris MCU performance for execution of additional advanced connectivity and control functions.

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An Introduction to the Stellaris® LM4F Family of Microcontrollers An Introduction to the Stellaris® LM4F Family of Microcontrollers
Stellaris® microcontrollers (MCUs) were the first MCU on the market to be based on the ARM® Cortex™-M core, an architecture that has quickly become a top choice for many developers across the globe. Since its establishment, the Stellaris product line has remained true to its original goals – providing the broadest portfolio of highly connected, low cost and easy-to-use 32-bit microcontrollers. The latest Stellaris LM4F series refines the offering of MCUs, greatly improving performance and raising features to a new level of quality.

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