Toshiba Electronics Education Zone

Toshiba Electronics Education Zone Mobile Peripherals

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Latest Issue: 23 - 29 May, 2012

Welcome to the Toshiba Electronics Education Zone on Electronics Weekly. Check back frequently as new videos and documents are loaded in each section. Topics covered include ASIC, Memory, Microcontrollers, Mobile Peripherals, Optical Devices, Power and Wireless Solutions.

This is the Mobile Peripherals section. To the main Toshiba Index Page >>

Products

	New MIPI® Camera sensor bridge IC provides extra freedom for designers Toshiba IC optimised for smartphones and other handheld devices. View release now
	TC358743 - HDMI to Camera Interface (CSI-2) Bridge Chip Toshiba’s HDMI to MIPI CSI-2 converter chip, designated TC358743XBG, enables an application processor with a MIPI CSI-2 interface to accept the video and audio content of an HDMI stream and process them as incoming data source. View guide now
	TC358762 De-Serializer Display Bridge - MIPI DSI to parallel converter bridge The Toshiba TC358762XBG de-serializer display bridge is optimised for mobile handsets using the Host processor with MIPI® DSI (Display Serial Interface) connectivity. View guide now
	TC358763 Serializer Display Bridge - Parallel to MIPI DSI converter bridge The Toshiba TC358763XBG serializer display bridge is optimised for mobile handsets using a high-resolution display panel with MIPI® Display Serial Interface (DSI) connectivity. View guide now
	TC358764/5 Display Bridge - MIPI DSI to LVDS The Toshiba TC358764/5 display bridge is optimised for mobile devices using a Host processor with MIPI DSI (Display Serial Interface) connectivity. View guide now
	TC358746 MIPI® CSI-2 Camera Bridge IC The Toshiba TC358746 camera bridge incorporates a Mobile Industry Processor Interface (MIPI) Camera Serial Interface Type 2 (CSI-2) that functions either as a CSI-2 receiver or as a CSI-2 transmitter. View guide now
	TC358766 Display Bridge for DisplayPort™ connectivity Toshiba Corporation announces that it has developed a new flip-flop circuit using 40nm CMOS process that will reduce power consumption in mobile equipment. View guide now
	Toshiba Develops New Energy-Saving Flip-Flop Circuit Toshiba Corporation announces that it has developed a new flip-flop circuit using 40nm CMOS process that will reduce power consumption in mobile equipment. View guide now