The Webinar was broadcast live, but you can still view the recording of the information. Watch it at your leisure on WorkCast.
Electronics Weekly joined forces with Goepel Electronics to discuss an important issue in the area of test, the X-ray inspection of solder joints in modern electronics productions. See Why only sample if a 100% x-ray inspection is possible?
You can also download an MP4 media recording of the Webinar »
The test specialists wrote:
The webinar deals with two different strategies for X-ray inspection of solder joints in modern electronics productions. On the one hand, the manual sample in-process inspection, which is usually carried out by trained personnel in multi-shift operation. On the other hand the fully automatic 100% inspection of each PCB directly in the production line. The advantages and disadvantages of these strategies are presented and a technical and economic comparison is explained.
In addition, the use of an X-line X-ray system for 100% solder joint inspection in the production line is described using a practical example. Free of reflections and shadows, all solder joints are inspected by X-ray technology and are evaluated equally, without human subjectivity. The result is the lowest pseudo-error rate, minimal failure escapes and complete documentation of the test results. Furthermore, the webinar presents the possibilities and limits of failure detection in many examples.
So, the four key takeaways from the event will be:
• Sample inspection vs. 100% x-ray inspection – technical and economic comparison
• X-ray inspection (AXI) compared to the automatic optical inspection (AOI)
• Possibilities and limitations of the failure detection of an AXI system
• Practical example for the 100% X-ray inspection of an PCB
He moved into sales from production in the 1990’s, since then he has been working with companies of all sizes from start ups to multi nationals with regional divisions. He has experience of manufacturing in a fast changing production environment and understands many of the issues encountered during the manufacturing process.