Chip kit firms in wafer sting

Chip kit firms in wafer sting
Roy Rubenstein Over $5.4bn has been wasted by semiconductor production equipment manufacturers developing machines which will never be used because they erroneously estimated the timing in demand for 300mm wafers, writes David Manners in Rome. Equipment manufacturers developed 300mm machines for 0.35?m, 0.25?m and 0.18?m processes. Now, it seems, that even 0.15?m devices will be run on 200mm wafers, making the investment redundant. However, instead of risking the shift to 300mm, chip manufacturers got the equipment companies to shoulder the risk. This resulted in equipment makers getting stung to the tune of $5.4bn, said Peter Dunn, publisher at Wafer News at this week’s ISS Conference.


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