IBM makes copper connection on SOI semiconductor process

IBM makes copper connection on SOI semiconductor process
David Manners
IBM Microelectronics has a copper interconnect on silicon on insulator (SOI) process available for prototyping which can draw gate lengths on silicon down to0.11?m.
“For the past couple of years our process technology has been very showy,” said Dr Lisa Su, project manager for CMOS Logic Technologies at IBM Microelectronics, pointing out that the 0.11?m features are drawn using a 248nm UV wavelength.
At the moment, the process is available to customers only for prototyping, but, said Su “it is ready to roll”.
Using copper interconnects speeds up chips by 10 to 20 per cent compared to aluminium, says IBM, while using SOI wafers improves transistor performance by up to 35 per cent and offers up to a threefold reduction in power.


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