Infineon to link up on IBM wafer fab

Infineon to link up on IBM wafer fab
David Manners Infineon Technologies (formerly Siemens Semiconductor) and IBM are negotiating a joint venture for the IBM wafer fab at Corbeil-Essonnes outside Paris which they hope to complete by the end of June. Whether it happens depends, in part, on IBM negotiating acceptable terms with its unions to lay off, re-deploy to other IBM locations, or give early retirement to 1,200 out of the current 2,800 employees at the site. If the deal goes through, $500m will be invested in the fab – $250m by each partner – to upgrade its process technology to make advanced logic ICs. Some 1,600 people will be retained to run the fab. Although IBM and Infineon have had a co-operation in the Corbeil-Essonnes fab, making first 16Mbit and then 64Mbit DRAMs, they have never had a formal joint venture there. If the Corbeil-Essonnes joint venture goes ahead it will be Infineon’s third, the others being at White Oak with Motorola in the US and ProMos with Mosel-Vitelic in Taiwan. Additionally, the German firm has sole control of three fabs: Dresden, Regensburg and Vilach in Austria.


Leave a Reply

Your email address will not be published. Required fields are marked *

*