Lucent teams with Chartered on 0.16micron CMOS process technology

Lucent teams with Chartered on 0.16micron CMOS process technology
Richard Wilson
Lucent Technologies and Chartered Semiconductor Manufacturing of Taiwan are to jointly develop fabrication processes for high-performance copper and aluminium interconnects in next-generation CMOS (0.18micron/0.16micron) integrated circuits.
The companies expect to begin prototyping new devices in the fourth this year. As part of the collaboration, the two companies will merge their development efforts on Lucent’s 0.16micron and Chartered’s 0.18micron technologies, to deliver a common manufacturing process platform using advanced low-k dielectric aluminium and copper interconnects.
The resulting processes will be optimised for ICs used in data communications, mobile communications, graphics, and consumer electronics.


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