Motorola and IHP to jointly develop unique next generation wireless technology

Motorola and IHP to jointly develop unique next generation wireless technology
Tom Foremski
Motorola is teaming up with the German based Institute for Semiconductor Physics (IHP) to jointly develop a 0.18 micron/ 0.25 micron wireless platform based on Motorola’s CMOS and IHP’s proprietary silicon germanium carbon (SiGeC) technologies.
Motorola says that the joint venture will produce a lower cost SiGe BiCMOS process technology with potential for system on a chip applications that will substantially reduce the cost for wireless communications products.
“The addition of carbon to silicon germanium significantly enhances performance and reduces cost,” said IHP director Abbas Ourmazd. The agreement calls for Motorola to establish a technology centre in Frankfurt to work closely with IHP and act as the European headquarters for Motorola’s Embedded Systems Technology Laboratories.
IHP has about 180 researchers and has joint R&D projects with more than 30 companies.


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