Toshiba eyes 300mm link up

Toshiba eyes 300mm link up
Roy Rubenstein Toshiba would like a 300mm wafer manufacturing alliance with Siemens in the absence of any consensus inside Japan on the way to go on 300mm wafer processing, writes David Manners in Japan. “If Siemens can show us a cost benefit then we would seriously consider an alliance,” Yoshihide Fujii, general manager of Toshiba’s business planning division, told EW. However, Harald Eggars, v-p of manufacturing at Siemens Semiconductors, told the ISS Conference in Rome last month that it could not yet demonstrate any economic advantages from using 300mm wafers. “Cost is the issue with 300mm,” said Fujii, “the merit of 300mm is just cost.” Fujii added: “There is no consensus in the Japanese semiconductor industry on 300mm. It is silly that each company is spending a lot of money.” Toshiba has been pursuing an alliance strategy for years. “The alliance strategy is most important,” said Fujii, adding that Toshiba would like more alliances but any new partnership would have to be acceptable to existing partners.


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