UK firm wins 3D accolade from ST

UK firm wins 3D accolade from ST
VideoLogic signs agreement with ST for PowerVR 3D technology. Richard Ball UK graphics chip designer VideoLogic has received a major boost for its 3D graphics technology with the signing of a development agreement with STMicroelectronics (ST). ST will develop 3D graphics chips based on the third generation of VideoLogic’s PowerVR architecture. The agreement adds to VideoLogic’s existing partnership with NEC. However, it does not mean the two semiconductor firms, NEC and ST, will be second sourcing parts. ‘They’ll be developing their own variants. They will not be producing the same parts,’ said Trevor Selby, finance director at VideoLogic. ‘It’s the same core Power-VR technology,’ Selby told Electronics Weekly. ‘NEC will address arcade, console and games markets, while STMicroelectronics will add PC and set-top box.’ ST is already heavily involved in the 3D graphics arena for PCs with its successful Riva cards, based on Nvidia technology. But the VideoLogic deal signals an end to further Riva chips. ST will continue to manufacture and sell existing Riva cards, so long as demand exists. ‘We don’t plan any further new designs with this technology,’ said Tim Chambers, general manager of ST’s graphics division. ‘Videologic’s PowerVR technology provides a better path to future high performance. It is definitely the 3D technology for the future.’ VideoLogic and ST have yet to release performance estimates for the third generation of PowerVR. Second generation chips from NEC are used by Sega in its Dreamcast games console and Naomi arcade system. The core delivers processing performance of three million polygons/s – significantly better than today’s PC graphics cards. This shows the architecture has the pedigree for PC and set-top box applications. PowerVR differs from other 3D graphics designs by removing redundant processing during texturing, shading and lighting operations. This reduces the demands made on main memory.


Leave a Reply

Your email address will not be published. Required fields are marked *

*