Using LDS (laser direct structuring) combined with a galvanic production line which is specifically developed for plating copper on 3D printed parts.
The LDS process is accomplished with an LPKF Microline 3D 160i direct image structuring machine.
The metallisation system is suitable for prototype production and plating of LDS components.
The company says it can now offer a complete service for three-dimensional circuit carriers from one source as well as laser structuring.
Customers can request a price quotation for 3D MID prototypes based on laser-sintered 3D printing, including component assembly.