Low profile Intel Core U industrial card 

Congatec has introduced a low profile industrial-grade motherboard family featuring the new 7th Gen Intel Core U (Kaby Lake) processors.

The boards incorporate a SIM card socket for 3G/4G or narrow band wireless.

Low profile Intel Core U industrial card 

The conga-IC175 Thin Mini-ITX motherboards ship with 4 different dual-core variants of 7th Gen Intel Core U SoC processors and have a configurable cTDP from 7.5 W to 25 W.

Two SO-DIMM sockets support up to 32GB DDR4-2133 memory.

For non-volatile memory the boards offer 1x M.2 slot supporting the Intel Optane low latency memory.

The boards connect the DirectX 12 capable Intel HD Graphics 620 with up to three independent displays in 4k resolution at 60Hz via 2x DP++ plus eDP or dual channel LVDS.

The industrial grade I/O set includes 2x Gigabit Ethernet and 1x SIM card socket for 3G/4G or Narrow Band M2M and IoT connectivity, 1x PCIe x4 and 1x mPCIe for generic expansions, 4x USB 3.0, 6x USB 2.0, 8x GPIO, and 2x serial COM ports – one of which can be configured as ccTalk.

The boards support the 64-bit versions of Microsoft Windows 10 and Windows 10 IoT as well as all common Linux operating systems.

Image: Conga-IC175 Thin Mini-ITX motherboard

See alsoCongatec module designed for big graphics, big data

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