VINco E3 features ‘SoLid Cover’ technology in an industry-standard low-profile package.
“It enables engineers to design mid-power inverters with higher output current, higher power density and improved reliability for motion control, industrial drives, solar power, UPS and other mid-power applications,” said Richardson.
The insulated metal base-plate has an electrically-insulating resin layer with direct-bonded top- and bottom-side copper layers.
“It replaces the substrate solder layer and separate base-plate to achieve high thermal cycling capability, reduced thermal resistance, and high power density and low stray inductance,” said Richardson,
Direct potting resin is claimed to distribute mechanical stress more uniformly than silicone gel for improved power cycling capability.
Inside are Mitsubishi Gen 7 chips.