Compared with IGBTs, at a chip temperature of 150°C, the firm is claiming 64% reduction in switching losses.
BSM600D12P3G001 achieves 600A rating through a new package, whose flatter baseplate decreases contact resistance by 57%.
Package inductance is also down by 23% vs its earlier products by optimising the placement of the SiC device inside the package and chaging the terminal pattern. “Rohm’s new G Type package suppresses surge voltage by 27% at the same loss compared with standard packages, enabling the development of 400A and 600A modules. In addition, this new package decreases switching loss by 24% under the same surge voltage drive conditions,” said the firm.
“From preliminary calculations based on loss simulation in cooling systems, adopting SiC modules can reduce the size of water-cooled heat sinks by up to 88% compared with equivalently rated IGBT modules,” claimed the firm, which introduced its first all-SiC power modules (1,200V 300A) in 2012.
88% is claimed with 20kHz PWM inverter drive, and less than 40um of thermal grease thickness.
There is also a 400A version, and a gate driver board is available to help with evaluation.