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Tag Archives: Leti

Leti writes ‘unbreakable’ security code on to the chip

Leti, the French microelectronics research centre, says it has developed a way to encrypt individual chips with a security code. Working with lithography equipment supplier Mapper Lithography, Leti says it has perfected a way to generate a non-falsifiable code using a new chip design that leverages direct multi-beam writing in a process that fits in a conventional CMOS flow with ...

French technology improves microdisplays

Next week at SPIE Photonics West in San Francisco, French research centre Leti will demonstrate a new curving technology for optical components that widens field of view and compensates for optical aberrations. Called Pixcurve, it is a proof of concept for optical components such as microdisplays, visible imagers and cooled infrared sensors used in mobile phones, telescopes, medical-imaging tools, IR ...

Leti trials TV White Space for post OFDM multicarrier waveform

Leti and CloudNet IT-Solutions, a Scottish SME specializing in TV White Space, has conducted field trial results for a new flexible multicarrier system in the Orkney Islands designed to demonstrate a new post-OFDM multicarrier waveform. The trial showed that the post-OFDM multicarrier waveform, a block filtered-OFDM (BF-OFDM), can overcome all shortcomings inherent in actual OFDM waveforms (WiFi/LTE) and is backward ...

Leti wristband monitors sleepers

Leti has developed a wristband that measures physical indicators of a range of conditions, including sleep apnea, dehydration and dialysis-treatment response. APNEAband provides real-time detection of sleep-apnea events caused by pauses in breathing or shallow breaths during sleep. The wristband measures heart rate, variation in the time interval between heartbeats, oxygen saturation levels in the blood and stress level. The ...

CMOS will cut cost of integrated photonics, says Leti

French research group Leti has demonstrated a III-V semiconductor fabrication technique which it says will simplify the production of lasers. Leti says it has integrated hybrid III-V silicon lasers on 200mm wafers using standard CMOS process flow. “This shows the way to transitioning away from 100mm wafers and a process based on bulk III-V technology that requires contacts with noble ...

Leti claims 3D chip breakthrough on 300mm wafers

Leti, an institute of CEA Tech, has announced the world’s first successful 300mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm and copper pads as small as 500nm. This was achieved in partnership with EV Group, a supplier of wafer bonding and lithography equipment. “To our knowledge, this is the first reported demonstration of sub-1.5µm pitch ...

French research looks to improve in-flight Wi-Fi

French researchers at Leti have developed a technique for testing high-speed wireless communications on airplanes that allows different system deployments in cabins. In a joint research project with Dassault Aviation, Leti, which is a research institute of CEA Tech, demonstrated a channel-measurement campaign over Wi-Fi frequency in several airplanes, including Dassault’s Falcon business jet. A radio-frequency channel emulator and the ...

Leti offers chip start-ups access to an emulator with Mentor

French microelectronics research organisation, Leti will provide access to the Mentor Veloce emulator for small firms and startups following a partnership with the EDA firm. Emulation is a technique used by major chip firms in the development of complex ICs, which allows them to debug the design at early stages by validating software before committing to silicon. However, emulators are high ...